Title:
RESISTOR FOR PLATING APPARATUSES, AND PLATING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/228398
Kind Code:
A1
Abstract:
The present invention provides: a resistor which makes it possible to improve the uniformity of a plating film that is formed on a substrate; and the like. The present invention provides a resistor for plating apparatuses for electric field control, the resistor being arranged between an anode and a holder, which holds an object to be plated, in a plating apparatus. This resistor for plating apparatuses comprises: a first resistive member which has a first surface and a plurality of first through holes that open to the first surface; and a second resistive member which has a second surface and a plurality of second through holes that open to the second surface. The first resistive member and the second resistive member are arranged such that the first surface and the second surface face each other; and this resistor for plating apparatuses is configured such that the size of overlappings of the plurality of first through holes and the plurality of second through holes is variable.
Inventors:
HIWATASHI RYOSUKE (JP)
MASUDA YASUYUKI (JP)
SHIMOYAMA MASASHI (JP)
MASUDA YASUYUKI (JP)
SHIMOYAMA MASASHI (JP)
Application Number:
PCT/JP2022/021706
Publication Date:
November 30, 2023
Filing Date:
May 27, 2022
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
C25D17/10
Foreign References:
| JPH02145791A | 1990-06-05 | |||
| JPS63176500A | 1988-07-20 | |||
| JPS5633500A | 1981-04-03 | |||
| JPH11246999A | 1999-09-14 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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