Title:
RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2024/085181
Kind Code:
A1
Abstract:
This resist composition contains a resin component (A1) having a structural unit (a0) derived from a compound represented by general formula (a0-1) (In the formula, R is a hydrogen atom, a C1-5 alkyl group, or a C1-5 alkyl halide group; La01 is a single bond or -C(=O)-O-; Ar is an aromatic ring; Ra01 is an acid dissociable group; Ra02 is an acid non-dissociable group including an aromatic ring; m1 and m2 are each an integer of 1 or greater; Ra03 is a substituent other than COORa01 and -Ra02; and m3 is an integer of 0 or greater.).
Inventors:
ONISHI KOSHI (JP)
Application Number:
PCT/JP2023/037680
Publication Date:
April 25, 2024
Filing Date:
October 18, 2023
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
G03F7/039; C08F12/22; G03F7/20
Foreign References:
| JP2022007909A | 2022-01-13 | |||
| JP2023108593A | 2023-08-04 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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