RESIN SUPPLY APPARATUS, RESIN MOLDING SYSTEM, AND METHOD FOR PRODUCING RESIN MOLDED ARTICLE

WIPO Patent Application WO/2023/042509

A1

A resin supply apparatus (A) is provided with: a plurality of resin storage parts (2) in which a plurality of columnar resin materials (T) can be stored; resin transport mechanisms (4) which respectively receive the resin materials (T) stored in the resin storage parts (2) and transfer the resin materials (T) while making the resin materials (T) face the same direction; feed guide parts (5) which respectively receive the resin materials (T) delivered from the plurality of resin transport mechanisms (4) sequentially and keep the resin materials (T) in an aligned state where the resin materials (T) are arranged linearly; a shift guide part (6) which is movable between a plurality of receiving positions (Px) at which the resin materials (T) are respectively received from the feed guide parts (5) and a common delivery position (Py) at which the received resin materials (T) are delivered; and a delivery mechanism (7) which delivers the resin materials (T) received by the shift guide part (6) toward a delivery port at the delivery position (Py).

JPH06278190	AUTOMATIC FEEDING METHOD FOR MOLDING MATERIAL
JPH0332807	RAW MATERIAL FEED DEVICE TO MOLDING MACHINE
JP2023112430	PLASTICIZATION DEVICE, THREE-DIMENSIONAL MOLDING DEVICE AND INJECTION MOLDING DEVICE

YOSHIDA SHUHEI (JP)

PCT/JP2022/024802

March 23, 2023

June 22, 2022

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TOWA CORP (JP)

B29C45/18; B29C31/00; B29C45/02; B29C45/76; H01L21/56

JPH08504697A	1996-05-21
JPH10113929A	1998-05-06
JP3132439U	2007-06-07
JP50469796A	1995-07-14

R&C IP LAW FIRM (JP)

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