Title:
RESIN SHEET, CONTAINER, CARRIER TAPE, AND ELECTRONIC COMPONENT PACKAGING
Document Type and Number:
WIPO Patent Application WO/2022/054355
Kind Code:
A1
Abstract:
This resin sheet is for molding, and comprises a substrate sheet and a surface layer that includes silicone and is provided to at least one surface of the substrate sheet. The silicone content in the surface layer is 0.3-4.0 g/m2. The substrate sheet is formed from a resin composition including 29-65 parts by mass of a styrene-conjugated diene block copolymer (A), 25-60 parts by mass of a polystyrene resin (B), and 8-20 parts by mass of a high impact polystyrene resin (C) (where the total of the (A) component, the (B) component, and the (C) component is 100 parts by mass). This carrier tape 100 is a molded body 16 of the resin sheet, and is provided with an accommodation section 20 that is capable of accommodating an item.
Inventors:
SAITO TAKESHI (JP)
YANAKA RYOSUKE (JP)
YANAKA RYOSUKE (JP)
Application Number:
PCT/JP2021/021608
Publication Date:
March 17, 2022
Filing Date:
June 07, 2021
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
B29C51/02; B29C48/08; B32B27/30; B65D71/70; B65D73/02; B65D85/86
Domestic Patent References:
WO2008023400A1 | 2008-02-28 |
Foreign References:
JP2006232914A | 2006-09-07 | |||
JP2009191187A | 2009-08-27 | |||
JP2008274215A | 2008-11-13 | |||
JP2010174166A | 2010-08-12 | |||
JP2005281555A | 2005-10-13 | |||
JPH0885532A | 1996-04-02 | |||
JPH07108637A | 1995-04-25 | |||
JP2009214476A | 2009-09-24 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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