Title:
RESIN SHEET, CONTAINER, CARRIER TAPE, AND ELECTRONIC COMPONENT PACKAGING BODY
Document Type and Number:
WIPO Patent Application WO/2022/030096
Kind Code:
A1
Abstract:
This resin sheet is used for molding, and is such that the impact strength in a DuPont impact test is 1.0 J or higher and the value obtained through integration from an origin point up to a strain occurring during fracture in a reaction strain curve obtained through a tension test is 80 N/m2 or less. This carrier tape 100 is a molded body 16 of the resin sheet, and is provided with an accommodating part 20 that is capable of accommodating an article.
Inventors:
YANAKA RYOSUKE (JP)
SAITO TAKESHI (JP)
SAWAGUCHI KOTA (JP)
SAITO TAKESHI (JP)
SAWAGUCHI KOTA (JP)
Application Number:
PCT/JP2021/021607
Publication Date:
February 10, 2022
Filing Date:
June 07, 2021
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
B32B27/00; B65D73/02; B65D85/38; C08J5/18
Domestic Patent References:
| WO2008018473A1 | 2008-02-14 | |||
| WO2011118522A1 | 2011-09-29 |
Foreign References:
| JP2005297504A | 2005-10-27 | |||
| JP2001171728A | 2001-06-26 | |||
| JP2017024291A | 2017-02-02 | |||
| JP2015147359A | 2015-08-20 | |||
| JP2014193560A | 2014-10-09 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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