Title:
RESIN MEMBER, REEL BODY, PACKAGE BODY, AND RESIN MATERIAL
Document Type and Number:
WIPO Patent Application WO/2024/058127
Kind Code:
A1
Abstract:
The present disclosure relates to a resin member including a resin component that exhibits tackiness upon photoreaction and a photo-radical generator.
Inventors:
MIYAMOTO YUKI (JP)
KONDOU HIDEKAZU (JP)
SAITO KOICHI (JP)
KONDOU HIDEKAZU (JP)
SAITO KOICHI (JP)
Application Number:
PCT/JP2023/033066
Publication Date:
March 21, 2024
Filing Date:
September 11, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C08L101/00; C08G18/50; C08G75/045; C08K5/5397
Domestic Patent References:
| WO2020209268A1 | 2020-10-15 | |||
| WO2023100861A1 | 2023-06-08 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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