Title:
RESIN MATERIAL AND RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/058117
Kind Code:
A1
Abstract:
The present disclosure relates to a resin material which contains a compound A that has a (meth)acryloyl group, a compound B that has two or more thiol groups, and photoradical generator that has a 5% weight loss temperature of 200°C or more, wherein: the compound A contains a compound A-1 that has three or more (meth)acryloyl groups; and at least one of the compound A and the compound B has a disulfide bond.
Inventors:
MIYAMOTO YUKI (JP)
KONDOU HIDEKAZU (JP)
SAITO KOICHI (JP)
KONDOU HIDEKAZU (JP)
SAITO KOICHI (JP)
Application Number:
PCT/JP2023/033033
Publication Date:
March 21, 2024
Filing Date:
September 11, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
C08L81/02; C08G75/045; C08K5/00
Domestic Patent References:
| WO2020209268A1 | 2020-10-15 | |||
| WO2020100491A1 | 2020-05-22 | |||
| WO2022153397A1 | 2022-07-21 |
Foreign References:
| JPH1121352A | 1999-01-26 | |||
| JPS5770895A | 1982-05-01 | |||
| US20210189069A1 | 2021-06-24 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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