Title:
RESIN FLOW ANALYSIS RESULT DISPLAY DEVICE AND METHOD FOR CONTROLLING RESIN FLOW ANALYSIS RESULT DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2024/084593
Kind Code:
A1
Abstract:
According to embodiments of the present disclosure, the resin flow analysis result display device (10) has: an actual molding result acquisition unit (22) that acquires actual molding results at each point in time; an analysis result acquisition unit (24) that acquires analysis results at each point in time; a correlation setting unit (28) that correlates the actual molding result and the analysis result where the resin discharge amount in actual molding matches the resin discharge amount in resin flow analysis; and a display control unit (30) that displays the correlated actual molding result and analysis result on the display unit.
Inventors:
YAMAWAKI TAKUTO (JP)
Application Number:
PCT/JP2022/038807
Publication Date:
April 25, 2024
Filing Date:
October 18, 2022
Export Citation:
Assignee:
FANUC CORP (JP)
International Classes:
B29C45/76
Attorney, Agent or Firm:
CHIBA Yoshihiro et al. (JP)
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