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Title:
RESIN FILM-FORMING MATERIAL AND RESIN FILM
Document Type and Number:
WIPO Patent Application WO/2024/080249
Kind Code:
A1
Abstract:
The present disclosure relates to a resin film-forming material comprising a compound A that includes two or more first groups and has an ester bond and a compound B that includes two or more second groups capable of forming a bond with the first group and can form a resin including an ester bond and a basic functional group via a reaction with the compound A.

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Inventors:
MIYAMOTO YUKI (JP)
KONDO HIDEKAZU (JP)
SAITO KOICHI (JP)
Application Number:
PCT/JP2023/036583
Publication Date:
April 18, 2024
Filing Date:
October 06, 2023
Export Citation:
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Assignee:
RESONAC CORP (JP)
International Classes:
C08G73/02; H01L21/301
Domestic Patent References:
WO2009119588A12009-10-01
Foreign References:
CN112321802A2021-02-05
JP2019044147A2019-03-22
CN106832269A2017-06-13
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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