Title:
RESIN, CURABLE RESIN COMPOSITION, AND CURED FILM
Document Type and Number:
WIPO Patent Application WO/2023/136135
Kind Code:
A1
Abstract:
The present invention provides a novel resin which includes a constituent unit having a heterocycle. A composition including this resin gives cured films with excellent solvent resistance even when heated at low temperatures, e.g., 150°C or lower. This resin comprises a constituent unit (Aa) having an α,β-unsaturated carbonyl group, a constituent unit (Ab) having an active methylene group or an active methine group, a constituent unit (Ac) having an acid group, and a constituent unit (Ad) having an optionally substituted heterocycle.
Inventors:
KAWANISHI YUTAKA (JP)
Application Number:
PCT/JP2022/048177
Publication Date:
July 20, 2023
Filing Date:
December 27, 2022
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C08F222/20; C08F226/12; C08F290/12; G03F7/038
Foreign References:
| JP2009244447A | 2009-10-22 | |||
| JP2003066592A | 2003-03-05 | |||
| JP2009091465A | 2009-04-30 | |||
| JP2018165351A | 2018-10-25 | |||
| JP2018135515A | 2018-08-30 |
Attorney, Agent or Firm:
NAKAYAMA, Tohru et al. (JP)
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