Title:
RESIN AND RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/265080
Kind Code:
A1
Abstract:
A resin according to the present invention has a chlorine atom amount of at most 0.03 mass% and a free acid amount of at most 0.03 mass% and satisfies the requirements of expression I and expression II. Expression I: (A-B)/A<0.01 Expression II: (A-C)/A>0.87 (where, in a thermal analysis measurement performed by raising the temperature from 40ºC to 600ºC at 5ºC/min in the atmosphere in TG/DTA, and maintaining the temperature at 600ºC for 10 minutes, the weight at 100ºC is defined as A, the weight at 200ºC is defined as B, and the weight when maintained at 600ºC for 10 minutes is defined as C.) According to the present invention, it is possible to provide a resin capable of improving inorganic powder solution stability, shape stability after molding into a predetermined shape, and decarbonization properties.
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Inventors:
ISHIKAWA YUKI (JP)
TERAGUCHI YUMIKO (JP)
OOHIGASHI YUJI (JP)
KAMOSHIDA NAOKI (JP)
TERAGUCHI YUMIKO (JP)
OOHIGASHI YUJI (JP)
KAMOSHIDA NAOKI (JP)
Application Number:
PCT/JP2022/024200
Publication Date:
December 22, 2022
Filing Date:
June 16, 2022
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08F16/38; C08K3/00; C08L29/14
Foreign References:
| JP2019065166A | 2019-04-25 | |||
| JP2015141883A | 2015-08-03 | |||
| JP2015088487A | 2015-05-07 | |||
| JP2011230943A | 2011-11-17 | |||
| JP2009263188A | 2009-11-12 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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