Title:
RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/102756
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a resin composition such that the minimum melt viscosity can be further reduced, the dielectric loss factor (Df) is low, and a cured article having a superior copper plating peel strength can be obtained, and provides a resin composition containing (A) a maleimide compound that has a isopropylidene group bonded to two aromatic carbon atoms in different aromatic rings, and (B) a resin having a vinyl phenyl group and/or a (meth)acryloyl group.
Inventors:
KAWAI KENJI (JP)
Application Number:
PCT/JP2021/041791
Publication Date:
May 19, 2022
Filing Date:
November 12, 2021
Export Citation:
Assignee:
AJINOMOTO KK (JP)
International Classes:
B32B27/34; C08F257/02; C08F290/00; H01L23/14; H05K1/03
Domestic Patent References:
| WO2020054601A1 | 2020-03-19 | |||
| WO2020217675A1 | 2020-10-29 | |||
| WO2020217676A1 | 2020-10-29 | |||
| WO2021182360A1 | 2021-09-16 |
Foreign References:
| JP2021116423A | 2021-08-10 | |||
| JP6752390B1 | 2020-09-09 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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