Title:
RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/264987
Kind Code:
A1
Abstract:
The present invention provides: a resin composition and a resin sheet, each of which exhibits excellent photocurability with respect to active energy rays including an i-ray having a wavelength of 365 nm in a light exposure step if used for the production of a multilayer printed wiring board, while being capable of providing excellent alkali developability in a development step; a high density printed wiring board which achieves a high-definition resist pattern by using this resin composition or this resin sheet; and a semiconductor device. A resin composition according to the present invention comprises: (A) a maleimide compound which contains a constituent unit represented by formula (1) and maleimide groups at both ends of the molecular chain; and (B) a photocuring initiator which has an absorbance of the wavelength of 365 nm (i-ray) of 2.0 or more.
Inventors:
KATAGIRI SHUNSUKE (JP)
KUMAZAWA YUNE (JP)
SUZUKI TAKUYA (JP)
KUMAZAWA YUNE (JP)
SUZUKI TAKUYA (JP)
Application Number:
PCT/JP2022/023713
Publication Date:
December 22, 2022
Filing Date:
June 14, 2022
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08F22/40; C08F2/50; G03F7/004; G03F7/027; G03F7/031; H05K1/03; H05K3/46
Domestic Patent References:
| WO2020262579A1 | 2020-12-30 | |||
| WO2020262580A1 | 2020-12-30 | |||
| WO2020262588A1 | 2020-12-30 | |||
| WO2018056466A1 | 2018-03-29 |
Foreign References:
| JP2010526846A | 2010-08-05 | |||
| JP2004534797A | 2004-11-18 | |||
| JP2006036750A | 2006-02-09 | |||
| JP2010032985A | 2010-02-12 | |||
| JP2015165297A | 2015-09-17 | |||
| JPH0912712A | 1997-01-14 | |||
| JP2014500852W | ||||
| JP2016531926W | ||||
| JP2021099141A | 2021-07-01 |
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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