Title:
RESIN COMPOSITION, RESIN SHEET, LAYERED PRODUCT, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE WITH RESIN COMPOSITION LAYER FOR SEMICONDUCTOR MOUNTING, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/262585
Kind Code:
A1
Abstract:
A resin composition which comprises a bismaleimide compound (A) comprising a constituent unit represented by formula (1) and maleimide groups at both ends of the molecular chain, a radical-polymerizable resin or compound (B) that is not the bismaleimide compound (A), and a hardening accelerator (C), wherein the radical-polymerizable resin or compound (B) includes at least one group selected from among citraconimide, vinyl, maleimide, (meth)acryloyl, and allyl groups.
Inventors:
OKANIWA MASASHI (JP)
TAKANO KENTARO (JP)
KIDA TSUYOSHI (JP)
TAKANO KENTARO (JP)
KIDA TSUYOSHI (JP)
Application Number:
PCT/JP2020/025148
Publication Date:
December 30, 2020
Filing Date:
June 26, 2020
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08G14/12; C08F222/40; C08K3/013; C08K3/36; C08L35/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2018056466A1 | 2018-03-29 |
Foreign References:
| JP2003141936A | 2003-05-16 | |||
| JP2011245675A | 2011-12-08 | |||
| JP2014001289A | 2014-01-09 | |||
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| JP2013112730A | 2013-06-10 | |||
| JP2003221443A | 2003-08-05 | |||
| JP2016196548A | 2016-11-24 | |||
| JP2013008800A | 2013-01-10 | |||
| JP2011157529A | 2011-08-18 | |||
| JP2006245242A | 2006-09-14 | |||
| JP2019029599A | 2019-02-21 | |||
| JP2018160566A | 2018-10-11 | |||
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| JPH0912712A | 1997-01-14 | |||
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Other References:
See also references of EP 3992221A4
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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