Title:
RESIN COMPOSITION, PREPREG, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2023/171215
Kind Code:
A1
Abstract:
One aspect of the present invention is a resin composition comprising a maleimide compound (A) having, in the molecule, an arylene structure bonded in a meta orientation and a benzoxazine compound (B) having an allyl group in the molecule.
Inventors:
SAITO HIROSUKE
OTSUKA HAJIME
OTSUKA HAJIME
Application Number:
PCT/JP2023/004122
Publication Date:
September 14, 2023
Filing Date:
February 08, 2023
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08L35/00; C08L25/08; C08L39/04; H05K1/03
Domestic Patent References:
| WO2021182360A1 | 2021-09-16 | |||
| WO2022054867A1 | 2022-03-17 |
Foreign References:
| JP2020158705A | 2020-10-01 | |||
| JP2021109960A | 2021-08-02 |
Attorney, Agent or Firm:
KOTANI, Masataka et al. (JP)
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