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Title:
RESIN COMPOSITION AND MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2022/163786
Kind Code:
A1
Abstract:
Provided are a resin composition having a biobased content of 37 mass% or more and a molded body obtained by using said resin composition, the resin composition containing: a block copolymer (A) that contains a polymer block (a1) containing a structural unit derived from an aromatic vinyl compound and a polymer block (a2) containing a farnesene-derived structural unit; a block copolymer (B) that contains a polymer block (b1) containing a structural unit derived from an aromatic vinyl compound and a polymer block (b2) containing at least 30 mol% of an isoprene-derived structural unit; a plasticizer (C); and a biomass-derived polyolefin resin (D).

Inventors:
KONISHI DAISUKE (JP)
SASAKI HIROMITSU (JP)
SEKIGUCHI TAKAHIRO (JP)
TOMISHIMA YUTA (JP)
HASEGAWA TAKUMI (JP)
Application Number:
PCT/JP2022/003193
Publication Date:
August 04, 2022
Filing Date:
January 28, 2022
Export Citation:
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Assignee:
KURARAY CO (JP)
International Classes:
C08F287/00; C08J5/18; C08L23/02; C08L53/00; C08L53/02; C08L57/02
Domestic Patent References:
WO2018232200A12018-12-20
WO2014156651A12014-10-02
Foreign References:
JP5763866B12015-08-12
JP5763865B12015-08-12
JP2012502135A2012-01-26
JP2012502136A2012-01-26
JP2011132298A2011-07-07
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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