Title:
RESIN COMPOSITION, RESIN MOLDED BODY, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2023/249036
Kind Code:
A1
Abstract:
Provided are: a resin molded body having excellent heat resistance, flame retardancy, mechanical strength and adhesion; and a resin composition for producing said resin molded body, the resin composition containing a (meth)acrylic polymer (P), a condensed phosphate ester (C1) and a compound (C2) represented by general formula (I). [In formula (I), Ra1, Rb1, and Rc1 each independently represent a hydrogen atom or a chloroalkyl group having 1-8 carbon atoms. Z represents a hydrogen atom, an alkyl group having 1-8 carbon atoms, or a chloroalkyl group having 1-8 carbon atoms. n represents an integer of 1-8.]
Inventors:
ISOMURA MANABU (JP)
ICHISE SHOUTA (JP)
ICHISE SHOUTA (JP)
Application Number:
PCT/JP2023/022859
Publication Date:
December 28, 2023
Filing Date:
June 21, 2023
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08L33/06; C07F9/40; C08F20/10; C08K5/51; C09K21/14
Domestic Patent References:
| WO2016063898A1 | 2016-04-28 |
Foreign References:
| JP2019189749A | 2019-10-31 | |||
| JP2021050257A | 2021-04-01 | |||
| JPS59206454A | 1984-11-22 | |||
| JP2018090731A | 2018-06-14 |
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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