Title:
RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2023/214485
Kind Code:
A1
Abstract:
This resin composition contains tris(2,4-di-tert-butylphenyl) phosphate (B) at a quantity of 0.001-0.5 parts by mass relative to 100 parts by mass of a polycarbonate resin (A), with the polycarbonate resin (A) containing constituent units represented by formula (1). In the resin composition, the value of (B)/(A-2), which is the ratio of the mass of constituent units represented by formula (1) relative to the mass of tris(2,4-di-tert-butylphenyl) phosphate (B), satisfies the relationship 0.00003 ≤ (B)/(A-2) ≤ 0.0050. In formula (1), R1 represents a methyl group.
Inventors:
HAMAGUCHI RYUKI (JP)
IRIE YASUYUKI (JP)
IRIE YASUYUKI (JP)
Application Number:
PCT/JP2023/012592
Publication Date:
November 09, 2023
Filing Date:
March 28, 2023
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08G64/06; C08L69/00; C08K5/523
Foreign References:
| JP2000239511A | 2000-09-05 | |||
| JPH11293101A | 1999-10-26 | |||
| JP2019182993A | 2019-10-24 | |||
| JPH09183894A | 1997-07-15 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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