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Patent Searching and Data


Title:
RESIN COMPOSITION AND MOLDED ARTICLE OF SAME
Document Type and Number:
WIPO Patent Application WO/2024/070340
Kind Code:
A1
Abstract:
The present invention provides a resin composition which is excellent in terms of impact resistance, fluidity and heat resistance, and which gives a molded article that has a satisfactory appearance and is highly inhibited from tape peeling at the molded article surface. The present invention provides a resin composition which contains, relative to 100 parts by weight of a resin component that is composed of (A) 45 parts by weight to 90 parts by weight of a polycarbonate resin (component A) and (B) 10 parts by weight to 55 parts by weight of a copolymer (component B) that is obtained by polymerizing an aromatic vinyl monomer and a vinyl cyanide monomer, (C) 0.5 part by weight to 10 parts by weight of an acrylic block copolymer (component C), (D) 0.01 part by weight to 3.0 parts by weight of a phosphorus antioxidant (component D), and (E) 0.01 part by weight to 3.0 parts by weight of a hindered phenolic antioxidant (component E).

Inventors:
ONISHI YOUSUKE (JP)
Application Number:
PCT/JP2023/030245
Publication Date:
April 04, 2024
Filing Date:
August 23, 2023
Export Citation:
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Assignee:
TEIJIN LTD (JP)
International Classes:
C08L69/00; C08K5/13; C08K5/49; C08L25/12; C08L53/00; C08L55/02
Domestic Patent References:
WO2020075655A12020-04-16
WO2002092696A12002-11-21
Foreign References:
JP2019116562A2019-07-18
CN105462224A2016-04-06
JP2004168822A2004-06-17
JP2016065141A2016-04-28
CN106854353A2017-06-16
JP2016050297A2016-04-11
JP2000154329A2000-06-06
Attorney, Agent or Firm:
TAMEYAMA Taro (JP)
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