Title:
RESIN COMPOSITION, CURED ARTICLE, LAMINATE, METHOD FOR PRODUCING CURED ARTICLE, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/190062
Kind Code:
A1
Abstract:
A resin composition containing a polyimide precursor that includes a repeating unit represented by formula (1) and a repeating unit represented by formula (2), a polymerizable compound, and a polymerization initiator; a cured article; a laminate; a method for producing a cured article; a method for producing a laminate; a method for producing a semiconductor device; and a semiconductor device.
Inventors:
NOZAKI ATSUYASU (JP)
Application Number:
PCT/JP2023/011591
Publication Date:
October 05, 2023
Filing Date:
March 23, 2023
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F283/04; C08F2/44; C08F290/14; C08G73/14; G03F7/027; G03F7/20
Domestic Patent References:
| WO2014097633A1 | 2014-06-26 |
Foreign References:
| JPS4923308B1 | 1974-06-14 | |||
| JPS5155397A | 1976-05-15 | |||
| JP2013155281A | 2013-08-15 | |||
| JP2021173787A | 2021-11-01 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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