RESIN COMPOSITION AND CURABLE RESIN COMPOSITION USING SAME

Title:

RESIN COMPOSITION AND CURABLE RESIN COMPOSITION USING SAME

Document Type and Number:

WIPO Patent Application WO/2023/149444

Kind Code:

A1

Abstract:

The purpose of the present invention is to provide a resin composition containing a 2-methylene-1,3-dicarbonyl compound and having improved workability.　The resin composition contains: (A) a 2-methylene-1,3-dicarbonyl compound having at least one structural unit represented by formula (I) and having a molecular weight of 230 to 1000; and (B) fumed silica having an average primary particle diameter of 1 to 50 nm and a specific surface area of 50 m2/g to 250 m2/g.

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Inventors:

YOSHII YU (JP)

Application Number:

PCT/JP2023/003141

Publication Date:

August 10, 2023

Filing Date:

February 01, 2023

Export Citation:

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Assignee:

NAMICS CORP (JP)

International Classes:

C08L35/02; C08F22/14; C08K3/36; C09J4/00; C09J135/00; C09K3/10

Domestic Patent References:

WO2018053454A1

2018-03-22

Foreign References:

JP2015518503A	2015-07-02
JP2015227433A	2015-12-17
JP2018193530A	2018-12-06
JP2022163967A	2022-10-27

Attorney, Agent or Firm:

TSUKUNI & ASSOCIATES et al. (JP)

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