Title:
RESIN COMPOSITION FOR ADHESIVE, ADHESIVE, AND ADHESION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/200812
Kind Code:
A1
Abstract:
Provided is a resin composition which is for an adhesive, has favorable adhesiveness to glass, is useful as a component of an adhesive having a favorable appearance after adhesion, and contains a polyhydroxyurethane resin. This polyhydroxyurethane resin contains a structural unit obtained by polymerizing a compound (A) having at least two five-membered cyclic carbonate structures with a compound (B) having at least two primary amino groups, and contains a urethane bond, a hydroxyl group, and a secondary amino group in the structural unit. Moreover, the polyhydroxyurethane resin has an amine value of 1-50 mg KOH/g and a hydroxyl value of 10-230 mg KOH/g.
Inventors:
MUTO KAZUAKI (JP)
KIMURA KAZUYA (JP)
TAKAHASHI KENICHI (JP)
KIMURA KAZUYA (JP)
TAKAHASHI KENICHI (JP)
Application Number:
PCT/JP2021/013265
Publication Date:
October 07, 2021
Filing Date:
March 29, 2021
Export Citation:
Assignee:
DAINICHISEIKA COLOR CHEM (JP)
International Classes:
C08G59/40; C08G71/04; C09J175/04
Foreign References:
| JP2018526472A | 2018-09-13 | |||
| JP2018203939A | 2018-12-27 | |||
| JP2017222760A | 2017-12-21 | |||
| JP2017014417A | 2017-01-19 | |||
| JP2009155407A | 2009-07-16 | |||
| JP2008001789A | 2008-01-10 | |||
| JP2008179689A | 2008-08-07 | |||
| JPH0275B2 | 1990-01-05 | |||
| JP2017014417A | 2017-01-19 | |||
| JP2018203939A | 2018-12-27 |
Attorney, Agent or Firm:
KONDO Rieko et al. (JP)
Download PDF:
Previous Patent: LAMINATED FILM
Next Patent: CERAMIC CIRCUIT BOARD, ELECTRONIC DEVICE, AND METAL MEMBER
Next Patent: CERAMIC CIRCUIT BOARD, ELECTRONIC DEVICE, AND METAL MEMBER