Title:
RESIN ADDITIVE, RESIN COMPOSITION, AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2022/176852
Kind Code:
A1
Abstract:
The present invention provides: a resin additive capable of imparting low temperature impact properties to a resin material; a resin composition containing said resin additive; and a molded article formed from said resin composition. The resin additive according to the present invention is a polymer having a structural unit (a1) derived from a monomer (1). The resin composition according to the present invention contains the resin additive and a resin material. The molded article according to the present invention is formed from said resin composition.
Inventors:
AOKI YUTAKA (JP)
NIINO HIROSHI (JP)
OKAMOTO EIKO (JP)
NISHII HIROYUKI (JP)
UEDA MASAHIRO (JP)
IIMORI MASASHI (JP)
KUWAHARA ATSUSHI (JP)
NIINO HIROSHI (JP)
OKAMOTO EIKO (JP)
NISHII HIROYUKI (JP)
UEDA MASAHIRO (JP)
IIMORI MASASHI (JP)
KUWAHARA ATSUSHI (JP)
Application Number:
PCT/JP2022/005940
Publication Date:
August 25, 2022
Filing Date:
February 15, 2022
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08F279/02; C08F220/00; C08L9/00; C08L33/06; C08L33/12; C08L101/00
Domestic Patent References:
| WO2017038725A1 | 2017-03-09 |
Foreign References:
| JP2013532767A | 2013-08-19 | |||
| JP2014189649A | 2014-10-06 | |||
| JP2017110070A | 2017-06-22 | |||
| JP2017145423A | 2017-08-24 | |||
| JPH06313016A | 1994-11-08 | |||
| JP2015511266A | 2015-04-16 | |||
| JP2021025659A | 2021-02-22 | |||
| JPS4910237A | 1974-01-29 | |||
| JP2015172208A | 2015-10-01 |
Other References:
"Polymer Handbook", WILEY-INTERSCIENCE
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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