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Title:
RELEASE FILM
Document Type and Number:
WIPO Patent Application WO/2023/218944
Kind Code:
A1
Abstract:
A release film including a polyester film and a release layer, wherein the release layer is a layer obtained by curing a silicone composition containing addition-curable silicone, and the silicone composition contains a resin containing neither a silicon atom nor a nitrogen atom in a molecule but containing multiple alkenyl groups and multiple rings in the molecule.

Inventors:
YAMAMOTO YUICHIRO (JP)
SHIBATA YUSUKE (JP)
Application Number:
PCT/JP2023/016297
Publication Date:
November 16, 2023
Filing Date:
April 25, 2023
Export Citation:
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Assignee:
TOYO BOSEKI (JP)
International Classes:
B32B27/00; B28B1/30; B32B7/06; B32B27/36
Foreign References:
JP2020146981A2020-09-17
JP2021091127A2021-06-17
JP2014213590A2014-11-17
JPH06116426A1994-04-26
JPH09241493A1997-09-16
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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