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Patent Searching and Data


Title:
REED RELAY AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/045944
Kind Code:
A1
Abstract:
The present application relates to the technical field of relays, and in particular, designs a reed relay and a manufacturing method therefor. The reed relay comprises a housing, a coil assembly, a reed switch, and a plurality of conductive pins; the housing is provided with an accommodating cavity; the coil assembly is arranged in the accommodating cavity, and the coil assembly comprises a coil frame and a coil wound on the coil frame; the reed switch is installed on the coil frame, and the reed switch is provided with a reed; the plurality of conductive pins are fixed to the coil frame, one end of each conductive pin is connected to the coil or the reed, and the other end of each conductive pin extends out of the housing; a filling agent is provided in the accommodating cavity, and the filling agent is used for fixing the coil assembly, the reed switch and the conductive pins in the accommodating cavity. The structure of the reed relay provided by the present application is beneficial to improving the stability of internal electrical connection of the reed relay, thereby improving the accuracy of controlling the on-off of a controlled circuit by the reed relay by means of a control circuit.

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Inventors:
LIU NATHAN (CN)
Application Number:
PCT/CN2023/108524
Publication Date:
March 07, 2024
Filing Date:
July 21, 2023
Export Citation:
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Assignee:
SHANGHAI MIRELAY ELECTRONICS CO LTD (CN)
International Classes:
H01H36/00; H01H11/04
Foreign References:
CN214254266U2021-09-21
CN202230908U2012-05-23
CN115410866A2022-11-29
CN205140862U2016-04-06
KR200439024Y12008-03-17
Attorney, Agent or Firm:
SHANGHAI JUNLIHENG INTELLECTUAL PROPERTY AGENCY (SPECIAL GENERAL PARTNERSHIP) (CN)
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