REACTIVE HOT-MELT ADHESIVE, BONDED BODY AND PRODUCTION METHOD FOR SAME, AND GARMENT

Title:

REACTIVE HOT-MELT ADHESIVE, BONDED BODY AND PRODUCTION METHOD FOR SAME, AND GARMENT

Document Type and Number:

WIPO Patent Application WO/2021/199339

Kind Code:

A1

Abstract:

A reactive hot-melt adhesive that contains a urethane prepolymer. When C(A) is the integral value of the peak observed at 163–170 ppm during 13C-NMR analysis of the urethane prepolymer, and C(B) is the integral value of the peak observed at 171–176 ppm, C(A) and C(B) satisfy expression (X).　(X) 0.36≤C(A)/(C(A)+C(B)).

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Inventors:

HISANO KAZUKI (JP)
QU SHUJIE (JP)
AOYAGI SHOTA (JP)
SUZUKI TAKUMA (JP)
KOMIYA SOUICHIROU (JP)
MAGOME KAZUYUKI (JP)
IMAI TAKUYA (JP)
KAMEI JUNICHI (JP)
SAITO KOICHI (JP)

Application Number:

PCT/JP2020/014927

Publication Date:

October 07, 2021

Filing Date:

March 31, 2020

Export Citation:

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Assignee:

SHOWA DENKO MATERIALS CO LTD (JP)

International Classes:

D06M17/10; C09J175/06

Domestic Patent References:

WO2016045074A1

2016-03-31

Foreign References:

JP2001026762A	2001-01-30
JPH0635386A	1994-02-10
JP4147571B2	2008-09-10
JP2008530308A	2008-08-07

Attorney, Agent or Firm:

HASEGAWA Yoshiki et al. (JP)

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