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Patent Searching and Data


Title:
RADIANT COOLING AND/OR HEATING ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2024/012410
Kind Code:
A1
Abstract:
A radiant cooling and/or heating assembly (10, 63, 76, 110, 200, 300) includes a housing (15, 115,216) containing a heat transfer pipe (20, 67, 80, 120, 226, 316) through which a heat transfer media is passable, at least one outer radiant heat transfer surface (50, 74, 87, 150, 213a, 213b, 313a, 313b) for heat transfer with the surrounding environment, a first heat transfer panel (30, 68, 81, 130, 230, 326) with a first inner heat transfer surface (52, 152), and a second heat transfer panel (16, 116, 228, 324) with a second inner heat transfer surface (51, 151) which faces the first inner heat transfer surface. The first heat transfer panel (30, 68, 81, 130, 230, 326) is in contact with part of the heat transfer pipe (20, 67, 80, 120, 226, 316), the first inner heat transfer surface (52, 152) and the second inner heat transfer surface (51, 151) are separated from each other by a separation (55, 73, 86, 156, 236, 332) which is filled at least partly with a carbon layer or coating.

Inventors:
CHAN YIM CHEONG (CN)
Application Number:
PCT/CN2023/106595
Publication Date:
January 18, 2024
Filing Date:
July 10, 2023
Export Citation:
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Assignee:
DREAMER LTD (CN)
International Classes:
F24D3/16; F24F5/00
Foreign References:
US5931381A1999-08-03
EP3217102A12017-09-13
JP2016200297A2016-12-01
CN1932393A2007-03-21
JP2001132960A2001-05-18
JP2005337522A2005-12-08
US20050045317A12005-03-03
US20200393148A12020-12-17
US6330980B12001-12-18
Attorney, Agent or Firm:
RUNPING & PARTNERS (CN)
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