QUBIT ASSEMBLY PREPARATION METHOD, QUBIT ASSEMBLY, QUANTUM CHIP, AND DEVICE

Title:

QUBIT ASSEMBLY PREPARATION METHOD, QUBIT ASSEMBLY, QUANTUM CHIP, AND DEVICE

Document Type and Number:

WIPO Patent Application WO/2023/045088

Kind Code:

A1

Abstract:

A qubit assembly preparation method, a qubit assembly, a quantum chip, and a device, relating to the technical field of micro-nano processing. The qubit assembly preparation method comprises: respectively preparing a waveguide film layer in at least two areas spaced apart from each other on a substrate (501), a side surface of each waveguide film layer being an inclined surface extending outward from the top; preparing, by means of a Dolan bridge photoresist structure, a qubit structure not connected to the waveguide film layers (502); removing an insulating layer in a first target area on the upper surface of a first superconducting portion and an insulating layer in a second target area on the upper surface of a second superconducting portion (503); and evaporating a connection layer on the waveguide film layers, the qubit structure, and the substrate between the waveguide film layers and the qubit structure to obtain a qubit assembly (504). According to the present solution, the performance of the prepared qubit assembly can be improved.

Inventors:

ZHANG WENLONG (CN)
DAI MAOCHUN (CN)

Application Number:

PCT/CN2021/135741

Publication Date:

March 30, 2023

Filing Date:

December 06, 2021

Export Citation:

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Assignee:

TENCENT TECH SHENZHEN CO LTD (CN)

International Classes:

H01L39/24; H01L39/02

Domestic Patent References:

WO2018106215A1

2018-06-14

Foreign References:

CN112054113A	2020-12-08
CN110034228A	2019-07-19
CN111554798A	2020-08-18

Other References: