Title:
QUANTUM CHIP PACKAGE APPARATUS AND MANUFACTURING METHOD THEREFOR, AND QUANTUM DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/030320
Kind Code:
A1
Abstract:
Disclosed are a quantum chip package apparatus and a manufacturing method therefor, and a quantum device. The quantum chip package apparatus comprises: a first substrate; a first coplanar waveguide transmission line, the first coplanar waveguide transmission line comprising a first central conduction band and first grounding conduction bands, which are located at two sides of the first central conduction band; and a first conductive layer, wherein the first conductive layer is formed on the first grounding conduction bands, the first conductive layer and the first grounding conduction bands, which are located at the two sides of the first central conduction band, form a first shielding cavity, and the first central conduction band is located in the first shielding cavity. By means of the quantum chip package apparatus provided in the embodiments, mutual crosstalk between transmission signals of quantum bits on a quantum chip can be effectively prevented.
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Inventors:
ZHAO YONGJIE (CN)
LI YE (CN)
JIA JIANHAO (CN)
FANG JIE (CN)
YANG HUI (CN)
LI YE (CN)
JIA JIANHAO (CN)
FANG JIE (CN)
YANG HUI (CN)
Application Number:
PCT/CN2022/115854
Publication Date:
March 09, 2023
Filing Date:
August 30, 2022
Export Citation:
Assignee:
ORIGIN QUANTUM COMPUTING TECH CO LTD (CN)
International Classes:
H01L39/02
Foreign References:
| CN113690363A | 2021-11-23 | |||
| US20030179055A1 | 2003-09-25 | |||
| US20040037062A1 | 2004-02-26 | |||
| JP2004247599A | 2004-09-02 |
Attorney, Agent or Firm:
BEYOND TALENT PATENT AGENT FIRM (CN)
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