Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PRODUCTION METHOD FOR PRESSURE-SENSITIVE ADHESIVE SHEET AND PRODUCTION METHOD FOR OPTICAL FILM EQUIPPED WITH PRESSURE-SENSITIVE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2024/019155
Kind Code:
A1
Abstract:
Provided in the present invention is a production method for a pressure-sensitive adhesive sheet in which the environmental burden during the process of producing the pressure-sensitive adhesive sheet can be further mitigated. A production method for a pressure-sensitive adhesive sheet according to the present invention includes: a step A for forming a first pressure-sensitive adhesive sheet by irradiating with light a first laminate that includes a first substrate sheet, a first coating layer including a first photocurable composition, and a first release liner, in said order; a step B for releasing the first release liner; and a step C for forming a second pressure-sensitive adhesive sheet by irradiating with light a second laminate that includes a second substrate sheet, a second coating layer including a second photocurable composition, and a second release liner, in said order. The first release liner released in step B is used as the second substrate sheet and/or the second release liner in step C. At least one photocurable composition selected from the group consisting of the first photocurable composition and the second photocurable composition includes an antioxidizing agent.

Inventors:
YAMAMOTO SATOSHI (JP)
KIMURA TOMOYUKI (JP)
SUGIYAMA SHOHEI (JP)
Application Number:
PCT/JP2023/026816
Publication Date:
January 25, 2024
Filing Date:
July 21, 2023
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J7/38; B32B27/00; C09J7/40; C09J11/06; C09J133/04; C09J201/00; G02B5/30
Domestic Patent References:
WO2013013568A12013-01-31
Foreign References:
JPH05311133A1993-11-22
KR101144172B12012-05-14
JP2000086984A2000-03-28
Attorney, Agent or Firm:
KAMADA Koichi et al. (JP)
Download PDF: