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Patent Searching and Data


Title:
PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2022/070350
Kind Code:
A1
Abstract:
A processing module (10) for performing processing of a workpiece by moving a tool (T) and a workpiece (W) relatively to each other is provided with: a spindle module (100) provided with a spindle (112) that is for mounting a tool on the lead end thereof and extends along a predetermined axis (OS); a table module (200) provided with a table (210) on which the workpiece is fixed; and connectors (126, 218) for connecting/separating the spindle module and the table module. At least one of the spindle module and the table module has a self-propelled module base (102, 202) that is capable of traveling on the floor surface.

Inventors:
NEBUKA TEPPEI (JP)
SUGIYAMA NAOKAZU (JP)
KONO KAZUMASA (JP)
WELLING DAVID (DE)
SCHARES RICHARD (DE)
REKERS SIMON (DE)
Application Number:
PCT/JP2020/037295
Publication Date:
April 07, 2022
Filing Date:
September 30, 2020
Export Citation:
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Assignee:
MAKINO MILLING MACHINE (JP)
International Classes:
B23P23/04; B23Q1/40; B23Q37/00; B23Q39/04; B23Q41/04; B23P21/00; B23Q7/00; B25J5/00
Domestic Patent References:
WO2019106364A12019-06-06
Foreign References:
JPS5942255A1984-03-08
JPH11179637A1999-07-06
JP2008213131A2008-09-18
JP2008229738A2008-10-02
US6920973B22005-07-26
JPS60221230A1985-11-05
JP2009061562A2009-03-26
US4636137A1987-01-13
JP2019038048A2019-03-14
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
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