PRIMER-EQUIPPED MATERIAL AND JOINED BODY

Title:

PRIMER-EQUIPPED MATERIAL AND JOINED BODY

Document Type and Number:

WIPO Patent Application WO/2021/215404

Kind Code:

A1

Abstract:

This primer-equipped material includes one or a plurality of primer layers that are layered onto a material layer. At least one of the primer layers is an in-situ polymerization-type composition layer comprising a polymer of an in-situ polymerization-type composition containing at least one type of resin selected from the group consisting of a vinyl chloride resin, a phenol resin, and a polyimide.

More Like This:

JPH11289011	LOW-RELATIVE-DIELECTRIC CONSTANT INSULATING FILM, FORMATION THEREOF, AND INTERLAYER INSULATING FILM
JP4907115	Polyolefin-based resin laminated sheet and PTP packaging using this
JP7256185	Multilayer cast film and its manufacturing method

Inventors:

OTANI KAZUO (JP)
MAEKAWA KOJI (JP)
NUMAO SHINJI (JP)
TAKAHASHI NOBUYUKI (JP)
NIIBAYASHI RYOTA (JP)

Application Number:

PCT/JP2021/015900

Publication Date:

October 28, 2021

Filing Date:

April 19, 2021

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SHOWA DENKO KK (JP)

International Classes:

B32B27/00; B29C65/04; C09D5/00; C09D127/06; C09D161/10; C09D177/00; C09D201/00

Domestic Patent References:

WO2019116879A1

2019-06-20

Foreign References:

JP2013107814A	2013-06-06
JP2014240283A	2014-12-25
JP2002205335A	2002-07-23

Attorney, Agent or Firm:

OHTANI PATENT OFFICE (JP)

Download PDF:

View/Download PDF PDF Help

Previous Patent: LITHIUM ION-CONDUCTIVE GLASS CERAMIC

Next Patent: IMMUNOSTIMULANT AND COMPOSITION FOR TREATMENT OR PREVENTION