Title:
PRESSURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2023/233819
Kind Code:
A1
Abstract:
The present invention provides a pressure sensor in which a decrease in sensitivity or leakage of a fluid can be prevented even when the pressure sensor receives pressure from the fluid. This pressure sensor comprises a housing (32) having a space inside that is a fluid flow channel (33), a sensor chip (31) that comprises a strain detection part (31b) and is constituted from a thin-film semiconductor, and a strain transmission material (36) that is provided inside the housing (32). The strain transmission material (36) comprises a pressure-receiving surface (36a) in contact with the space that is a flow channel (33), and a joining surface (36b) that is positioned on the opposite side of the strain transmission material (36) from the pressure-receiving surface (36a) and is fixed to an inside surface of the housing (32). The entire sensor chip (31) is embedded inside the strain transmission material (36).
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Inventors:
YAMASAKI TATSUYA (JP)
KANAMARU MASATOSHI (JP)
AONO TAKANORI (JP)
SUZUKI YOICHIRO (JP)
KANAMARU MASATOSHI (JP)
AONO TAKANORI (JP)
SUZUKI YOICHIRO (JP)
Application Number:
PCT/JP2023/014233
Publication Date:
December 07, 2023
Filing Date:
April 06, 2023
Export Citation:
Assignee:
HITACHI HIGH TECH CORP (JP)
International Classes:
G01L9/00; G01L7/00; G01L19/06; G01L19/14
Foreign References:
| JP2021162447A | 2021-10-11 | |||
| JPH05332863A | 1993-12-17 | |||
| JP2018155632A | 2018-10-04 | |||
| JPH09138172A | 1997-05-27 | |||
| US5581038A | 1996-12-03 |
Attorney, Agent or Firm:
POLAIRE I.P.C. (JP)
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