Title:
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/024501
Kind Code:
A1
Abstract:
[Problem] The purpose of the present invention is to provide a positive photosensitive resin composition capable of forming a cured film which is used for liquid-crystal display elements, organic EL display elements, and the like and has a surface with high water repellency and high oil repellency, which has little residue after patterning, and on which an organic functional ink does not overflow but wet-spreads satisfactorily within the pattern formed by patterning. [Solution] This positive photosensitive resin composition contains component (A), component (B), component (C), component (D), component (E), and solvent (F) below and contains no photoacid generator, the positive photosensitive resin composition being capable of forming a cured film.
Component (A): at least one alkali-soluble polymer obtained by polymerizing a monomer mixture including (A-I) below; (A-I): N-substituted maleimide compound; component (B): surfactant; component (C): compound having a vinyl ether group; component (D): photosensitizer; component (E): crosslinking agent; and (F) solvent.
Inventors:
TSUJIMOTO HARUKI (JP)
Application Number:
PCT/JP2023/025623
Publication Date:
February 01, 2024
Filing Date:
July 11, 2023
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
G03F7/023; C08F265/06; G02B5/20; G03F7/004
Domestic Patent References:
| WO2016088757A1 | 2016-06-09 | |||
| WO2020240925A1 | 2020-12-03 |
Foreign References:
| JP2008003532A | 2008-01-10 |
Attorney, Agent or Firm:
HANABUSA PATENT & TRADEMARK OFFICE (JP)
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