POLYMERIZABLE COMPOSITION AND MANUFACTURING METHOD FOR ELEMENT-MOUNTED SUBSTRATE

WIPO Patent Application WO/2022/138012

A1

Provided are: a polymerizable composition that is used in order to restrict a region where a sealing agent can flow in a sealing step in which at least a portion of an element provided on a substrate is sealed by using the sealing agent, and in order to form a sealing agent restricting material which is removed from the substrate after the sealing step, and that is capable of forming a sealing agent restricting material which can easily be removed from the substrate without utilizing solder melting; and a manufacturing method for an element-mounted substrate, the method using the polymerizable composition.　This polymerizable composition, which includes a water-soluble polymer, a nitrogen-containing monofunctional (meth)acrylic monomer, and a polymerization initiator, is used in order to restrict a region where a sealing agent can flow in a sealing step in which at least a portion of an element provided on a substrate is sealed by using the sealing agent, and in order to form a sealing agent restricting material that is removed from the substrate after the sealing step.

UEMATSU TERUHIRO (JP)

PCT/JP2021/043797

June 30, 2022

November 30, 2021

Click for automatic bibliography generation  

TOKYO OHKA KOGYO CO LTD (JP)

C08F251/02; C08F2/44; C08L1/00; C08L33/26; C09D4/02; H01L23/29; H01L23/31

WO2002093213A1

2002-11-21

JPH08184786A	1996-07-16
JP2011174972A	2011-09-08
JPH08325476A	1996-12-10
JPH11326916A	1999-11-26
US20130163255A1	2013-06-27

SHOBAYASHI Masayuki et al. (JP)

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