Title:
POLYESTER-BASED PRESSURE-SENSITIVE ADHESIVE COMPOSITION, POLYESTER-BASED PRESSURE-SENSITIVE ADHESIVE, PRESSURE-SENSITIVE ADHESIVE SHEET, DECORATIVE FILM, FILM FOR ELECTRONIC MEMBER, AND DECORATIVE MOLDED OBJECT
Document Type and Number:
WIPO Patent Application WO/2023/182325
Kind Code:
A1
Abstract:
Provided is a polyester-based pressure-sensitive adhesive composition capable of forming a pressure-sensitive adhesive excellent in terms of adhesive force, heat resistance, moist heat resistance, and optical properties. The polyester-based pressure-sensitive adhesive composition comprises a polyester-based resin (A) and a polyepoxy-based compound (B), wherein the polyester-based resin (A) comprises structural units derived from a polycarboxylic acid and structural units derived from a polyhydric alcohol, the structural units derived from a polycarboxylic acid including a specific amount of a structural unit derived from a cyclic structure and the structural units derived from a polyhydric alcohol including a structural unit derived from an aliphatic polyhydric alcohol. The polyester-based resin (A) has a specific acid value and a specific glass transition temperature.
Inventors:
SAKAMOTO KENTO (JP)
NAKANE TAKAYUKI (JP)
NAKANE TAKAYUKI (JP)
Application Number:
PCT/JP2023/011093
Publication Date:
September 28, 2023
Filing Date:
March 22, 2023
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C09J11/06; C09J7/38; C09J163/00; C09J167/00
Domestic Patent References:
| WO2008069298A1 | 2008-06-12 | |||
| WO2021200713A1 | 2021-10-07 |
Foreign References:
| JPH06145633A | 1994-05-27 | |||
| JP2018193537A | 2018-12-06 | |||
| JP2009280776A | 2009-12-03 | |||
| JPH04328186A | 1992-11-17 | |||
| JP2021134344A | 2021-09-13 |
Attorney, Agent or Firm:
SAITOH Yukihiko et al. (JP)
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