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Title:
POLYESTER-BASED HEAT SHRINK FILM
Document Type and Number:
WIPO Patent Application WO/2023/032429
Kind Code:
A1
Abstract:
Provided is a polyester-based heat shrink film capable of effectively suppressing a blocking phenomenon when being recycled. The present invention provides a polyester-based heat shrink film originating from a first polyester resin and a second polyester resin that serve as a plurality of polyester resins differing from each other in terms of the crystallinity, wherein the following properties (A)-(E) are satisfied. (A) and (B) The first polyester resin contains terephthalic acid, the reacting weight thereof with respect to ethylene glycol is in a range of values that are equal to or greater than 50 mol% and less than 90 mol%, the second polyester resin contains terephthalic acid, and the reacting weight thereof with respect to ethylene glycol is equal to or greater than 90 mol%. (C) and (D) In the case in which prescribed isothermal crystallization measurement is performed, a heat generation peak appears within 12 min. from the start, including the time for performing a cooling step, and the amount of heat at the heat generation peak is 5-35 J/g. (E) The thermal shrinkage percentage in the principal shrinkage direction measured under prescribed conditions is 20-60%.

Inventors:
IRIFUNE TATSUYA (JP)
KANEKO TAKUMA (JP)
KANZAKA YUICHIRO (JP)
YUGE SHUUTA (JP)
Application Number:
PCT/JP2022/024981
Publication Date:
March 09, 2023
Filing Date:
June 22, 2022
Export Citation:
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Assignee:
C I TAKIRON CORP (JP)
International Classes:
C08J5/18; B29C61/06
Domestic Patent References:
WO2022044959A12022-03-03
Foreign References:
JPS6164430A1986-04-02
JPS6295341A1987-05-01
JPS61203161A1986-09-09
JP2010248496A2010-11-04
JPH01127317A1989-05-19
JP2007056156A2007-03-08
Attorney, Agent or Firm:
EMORI Kenji et al. (JP)
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