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Patent Searching and Data


Title:
POLISHING SLURRY COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/096277
Kind Code:
A1
Abstract:
The present invention relates to a polishing slurry composition. An embodiment pertains to a polishing slurry composition for organic membrane polishing, the composition including: polishing particles containing metal-coated metal oxide; and a polishing modifier containing a sulfur compound.

Inventors:
LEE I SOM (KR)
CHOI BO HYEOK (KR)
Application Number:
PCT/KR2023/012141
Publication Date:
May 10, 2024
Filing Date:
August 17, 2023
Export Citation:
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Assignee:
KCTECH CO LTD (KR)
International Classes:
C09G1/02; C09K3/14; H01L21/306; H01L21/3105
Foreign References:
KR20180118580A2018-10-31
KR20160105033A2016-09-06
KR20170040036A2017-04-12
US20160122590A12016-05-05
JP2009087967A2009-04-23
Attorney, Agent or Firm:
MUHANN PATENT & LAW FIRM (KR)
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