Title:
POLISHING BRUSH AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/004124
Kind Code:
A1
Abstract:
This polishing brush (1) has a rod-form member (2), and an abrasive-material bundle (4) comprising a plurality of linear abrasive materials (3). In the rod-form member (2), a holding hole (6) for holding the abrasive-material bundle (4) is provided in a front-side portion (2a). The holding hole (6) is provided with a bottom surface (7), and a tubular peripheral wall surface (8) extending from the bottom surface (7) in a sloping direction (S). The abrasive-material bundle (4) is provided with an accommodation portion (4a) accommodated in the holding hole (6), and a protruding portion (4b) that protrudes in the sloping direction (S) from the opening (6a) of the holding hole (6). The distal end of the protruding portion (4b) is positioned on the outer side of the rod-form member (2) as seen from an axis (L0) direction.
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Inventors:
SATO KOJI (JP)
Application Number:
PCT/JP2021/017425
Publication Date:
January 06, 2022
Filing Date:
May 07, 2021
Export Citation:
Assignee:
XEBEC TECH CO LTD (JP)
TAIMEI CHEMICALS CO LTD (JP)
TAIMEI CHEMICALS CO LTD (JP)
International Classes:
B24D13/14; B24B9/00; B24B29/00
Foreign References:
| DE3116326A1 | 1982-11-18 | |||
| JPS61265104A | 1986-11-22 | |||
| JP2004142042A | 2004-05-20 | |||
| JP2001321225A | 2001-11-20 | |||
| JP2004142042A | 2004-05-20 |
Attorney, Agent or Firm:
KAWAI Toru et al. (JP)
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