Title:
PLATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/243079
Kind Code:
A1
Abstract:
Provided is a plating device with which it is possible to clean a contact cleaning member. The plating device includes: a plating tank configured to contain a plating solution; a substrate holder configured to hold a substrate in which the surface to be plated is facing downwards, the substrate holder having a contact member for supplying power to the substrate; a contact cleaning member 482 for discharging a cleaning solution towards the contact member when at a cleaning position between the plating tank and the substrate holder; a drive mechanism 476 configured to move the contact cleaning member 482 between a cleaning position and a retracted position retracted from between the plating tank and the substrate holder; and a nozzle cleaning cover 489 configured to cover the upper part of the contact cleaning member 482 when the contact cleaning member 482 is at the retracted position.
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Inventors:
TOMITA MASAKI (JP)
YAMAMOTO KENTARO (JP)
YAMAMOTO KENTARO (JP)
Application Number:
PCT/JP2022/024316
Publication Date:
December 21, 2023
Filing Date:
June 17, 2022
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
C25D21/08; C25D17/06
Foreign References:
| JP7047200B1 | 2022-04-04 | |||
| JP2006114884A | 2006-04-27 | |||
| CN112779579A | 2021-05-11 | |||
| JP6934127B1 | 2021-09-08 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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