Title:
PLATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/233571
Kind Code:
A1
Abstract:
To provide a technology with which it is possible to suppress uneven film thickness of the outer edge of a substrate. This plating device 1 comprises a plating tank, an anode, a substrate holder, at least one auxiliary anode 60a-60d, a bus bar 61 having a power supply portion 62 to which electricity is supplied and a plurality of connection portions 63 connected to the at least one auxiliary anode and arranged in the extending direction of the auxiliary anode, and at least one ion resistor 80a-80d. The ion resistor is configured such that the resistivity of the ion resistor increases with proximity to the power supply portion in the extending direction of the ion resistor.
Inventors:
NAKAHAMA SHIGEYUKI (JP)
Application Number:
PCT/JP2022/022275
Publication Date:
December 07, 2023
Filing Date:
June 01, 2022
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
C25D17/10
Foreign References:
| JP2021011624A | 2021-02-04 | |||
| US20160333495A1 | 2016-11-17 | |||
| JP2002004091A | 2002-01-09 | |||
| JP2000290798A | 2000-10-17 | |||
| JPS54138625A | 1979-10-27 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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