FIELD

This invention relates to a plasma deposition apparatus, and in particular to a plasma deposition apparatus for application on soft goods.

BACKGROUND

Soft goods typically comprise textile products such as clothing, wound dressings, fabrics and bedding, as well as wearable technology products, shoes, low density plastics, PU foam, leather etc., and may be surface treated to provide them with functionalized coatings, for example, to render them hydrophilic or hydrophobic. However, there are several general properties that need to be maintained during and after surface coating of soft goods substrates, such as colour, hand feel and breathability of the substrate. One of the most important requirements is that such coating should withstand several wash cycles, i.e., the added coating should withstand the chemical and physical conditions of the washing process. In addition, to be commercially viable, plasma treatment of soft goods should be capable of applying the chemicals onto multiple items in each plasma deposition, and the functionalities of the chemical application should be evenly distributed on each substrate item. However, this is particularly difficult to achieve on soft goods due to factors such as plasma distribution in the plasma chamber and the complex three- dimensional shapes of many soft good items such as clothing, as well as machine settings during plasma treatment. There is thus a demand for a plasma deposition apparatus and process that can provide uniform plasma deposition on soft goods for bulk manufacture.

SUMMARY

According to a first aspect, there is provided a plasma deposition apparatus comprising: a plasma chamber for plasma deposition of a chemical on a substrate in the plasma chamber; a thermal energizer to thermally energize the chemical prior to plasma deposition in the plasma chamber; at least one radio frequency (RF) electrode provided within the plasma chamber to energize by RF the thermally-energized chemical to a plasma state; and a guide screen provided within the plasma chamber between the at least one RF electrode and the substrate to guide the thermally- energized chemical to a space where the at least one RF electrode is provided and to increase turbulence of flow of the chemical in plasma state from the at least one RF electrode to the substrate for deposition on the substrate of the chemical in plasma state with increased turbulence of flow, thereby increasing functional consistency and distribution of plasma deposition on the substrate. The thermal energizer may comprise a heating chamber; at least one fluid inlet wherein one of the at least one fluid inlet may be to supply the chemical into the heating chamber; a heater to heat and thereby thermally energize the chemical in the heating chamber; and an outlet to supply the thermally-energized chemical from the heating chamber to the plasma chamber.

The at least one fluid inlet may comprise at least one fluid injector.

The at least one fluid injector may comprise at least one of: a gas injector and a liquid injector.

The at least one fluid injector may comprise a first fluid injector and a second fluid injector, the first fluid injector driven by a first pulse width modulated (PWM) signal and the second fluid injector driven by a second PWM signal, the first PWM signal and the second PWM signal being out of phase.

The plasma deposition apparatus may further comprise an atomizing mechanism to atomize the chemical in the heating chamber to enhance heat transfer to the chemical when the chemical may be supplied as a liquid into the heating chamber.

The guide screen is electrically conductive and may comprise a number of walls, each wall comprising a plurality of spaced-apart panels, each panel having openings, wherein the openings between adjacent panels may be misaligned to change direction of flow of the chemical in plasma state through the guide screen.

Each panel may comprise spaced-apart metallic strips, wherein each opening in each panel may comprise a slot between adjacent spaced-apart metallic strips.

Adjacent panels of each wall may be parallel and spaced apart from each other by a displacement ranging from 10 mm to 30 mm.

The plasma chamber may comprise a chemical inlet in fluid communication with the outlet of the thermal energizer.

The guide screen may include an imperforated shield to shield the substrate from the thermally- energized chemical entering the plasma chamber through the chemical inlet of the plasma chamber. The chemical inlet may be located at a ceiling of the plasma chamber.

The imperforated shield may be provided as a roof atop upstanding walls of the guide screen.

The guide screen may be spaced apart from walls of the plasma chamber and the at least one RF electrode may be provided between the guide screen and the walls of the plasma chamber.

The guide screen may comprise three walls provided in a U-shaped configuration adjacent and spaced apart from a rear wall and two opposing side walls of the plasma chamber.

The at least one RF electrode may be angled with an internal angle greater than 90° and less than 180°.

The plasma chamber may be provided with a plurality of selectable vacuum ports for outflow from the plasma chamber to create a vacuum in the plasma chamber.

The guide screen may at least partially define a volume of at least 2600 litres in which the substrate may be to be provided for plasma deposition.

The plasma deposition apparatus may further include a substrate rack configured to allow multiple items of the substrate to be provided in a spaced-apart manner from each other within the plasma chamber.

The substrate rack may be configured to rotate the multiple items of the substrate about an axis of the substrate rack during plasma deposition.

The at least one RF electrode may be provided between the guide screen and at least one wall of the plasma chamber to create a region of plasma concentration in the space between the guide screen and the at least one wall of the plasma chamber to enhance probability of the thermally- energized chemical being energized to the plasma state.

According to a second aspect, there is provided a method of plasma deposition of a chemical on a substrate, the method comprising the steps of: a) thermally energizing the chemical; b) energizing by RF the thermally-energized chemical to a plasma state; c) increasing turbulence of flow of the chemical in plasma state during flow of the chemical in plasma state towards the substrate; and d) depositing on the substrate the chemical in plasma state with increased turbulence of flow of the chemical in plasma state.

Step (a) may comprise supplying the chemical into a heating chamber of a thermal energizer and heating the chemical in the heating chamber.

Supplying the chemical may comprise injecting the chemical through a first fluid injector of the thermal energizer.

The method may further comprise supplying another substance into the heating chamber through a second fluid injector, wherein supplying the chemical may comprise driving first fluid injector with a first pulse width modulated (PWM) signal and supplying the another substance may comprise driving the second fluid injector with a second PWM signal, the first PWM signal and the second PWM signal being out of phase.

The method may further comprise atomizing the chemical in the heating chamber to enhance heat transfer to the chemical when the chemical may be supplied as a liquid into the heating chamber.

Step (b) may comprise providing the thermally-energized chemical into a plasma chamber provided with at least one RF electrode to energize by RF the thermally-energized chemical to the plasma state.

The method may further comprise directing the thermally-energized chemical to a space where the at least one RF electrode is provided, thereby increasing efficiency of energizing the thermally-energized chemical to a plasma state.

The method may further comprise providing the substrate in the plasma chamber and shielding the substrate from the thermally-energized chemical entering the plasma chamber.

Step (c) may comprise changing direction of flow of the chemical in plasma state through a guide screen. Changing direction of flow may comprise flowing the chemical in plasma state through misaligned openings between adjacent panels of a plurality of panels of the guide screen.

The method may further comprise creating a vacuum in a plasma chamber in which the chemical in plasma state having increased turbulence of flow may be deposited on the substrate, wherein creating the vacuum may comprise periodically changing a selection of a number of a plurality of selectable vacuum ports for outflow from the plasma chamber.

The chemical may comprise monomers of hexamethyldisiloxane (HMDSO), wherein temperature of a heater of the heating chamber ranges from 100 °C to 300 °C, wherein the another substance may comprise an inert gas wherein supply flow rate of the argon gas ranges from 500 seem to 900 seem, wherein supply rate of the monomers of HMDSO ranges from 0.5 g/min to 5 g/min, wherein temperature of the plasma chamber ranges from 150 °C to 200 °C, wherein RF energy percentage applied by the at least one RF electrode during RF energizing ranges from 50 % to 90 %, and wherein duration of plasma deposition ranges from 15 to 45 minutes.

The chemical may comprise monomers of 2-(Perfluorohexyl) ethyl methacrylate, wherein temperature of a heater of the heating chamber ranges from 100 °C to 300 °C, wherein the another substance may comprise an inert gas, wherein supply flow rate of the argon gas ranges from 500 seem to 900 seem, wherein supply rate of the monomers of 2-(Perfluorohexyl) ethyl methacrylate ranges from 0.5 g/min to 5 g/min, wherein temperature of the plasma chamber ranges from 150 °C to 200 °C, wherein RF energy percentage applied by the at least one RF electrode during RF energizing ranges from 40 % to 90 %, and wherein duration of plasma deposition ranges from 15 to 45 minutes.

The chemical may comprise water, wherein temperature of a heater of the heating chamber ranges from 50 °C to 200 °C, wherein the another substance may comprise oxygen gas, wherein supply flow rate of the oxygen gas ranges from 10 seem to 70 seem, wherein supply rate of the water ranges from 0.1 g/min to 2 g/min, wherein temperature of the plasma chamber ranges from 150 °C to 200 °C, wherein RF energy percentage applied by the at least one RF electrode during RF energizing ranges from 50 % to 90 %, and wherein duration of plasma deposition ranges from 10 to 50 minutes. The chemical may comprise argon gas, wherein temperature of a heater of the heating chamber ranges from 50 °C to 200 °C, wherein the another substance may comprise oxygen gas, wherein supply flow rate of the oxygen gas ranges from 10 seem to 70 seem, wherein supply flow rate of the argon gas ranges from ranges from 300sccm to 600 seem, wherein temperature of the plasma chamber ranges from 50 °C to 120 °C, wherein RF energy percentage applied by the at least one RF electrode during RF energizing ranges from 60 % to 90 %, and wherein duration of plasma deposition ranges from 10 to 50 minutes.

As will be appreciated, the chemical may be a mixture of one or more of the materials mentioned hereinbefore.

The method may further comprise rotating the substrate about an axis of a substrate rack during at least steps (b) to (d).

The method may be performed using the plasma deposition apparatus of the first aspect.

In a further aspect of the invention, there is provided a treated textile product having at least one fabric surface, where the fabric surface is coated with plasma-polymerised hexamethyldisiloxane, wherein the textile product displays one of more of the following properties:

(a) an improved colourfastness to water when compared to an untreated textile that is otherwise identical to the textile product;

(b) an improved colourfastness to perspiration when compared to an untreated textile that is otherwise identical to the textile product; and

(c) improved anti-snagging properties when compared to an untreated textile that is otherwise identical to the textile product.

The treated textile product according may be one where the textile product displays two of more of the properties (a) to (c) as deserbed above, optionally wherein the textile product displays all of the properties (a) to (c) as deserbed above.

The treated textile product may be one where the plasma-polymerised hexamethyldisiloxane coating is formed using a process as described above. In this embodiment, the treated textile product, may be one where the treated textile product displays one or more of the following properties: (A) an improved colourfastness to water when compared to an untreated textile that is otherwise identical to the textile product;

(B) an improved colourfastness to perspiration when compared to an untreated textile that is otherwise identical to the textile product; and

(C) improved anti-snagging properties when compared to an untreated textile that is otherwise identical to the textile product.

For example, the treated textile product may be one where it displays two of more of the properties (A) to (C) as described above, optionally wherein the textile product displays all of the properties (A) to (C) as described above. More particularly, the treated textile product according made using the method described above may display one or more of the following properties:

(i) an improved colourfastness to water when compared to a textile treated by a different plasma-polymerised hexamethyldisiloxane process, but is otherwise identical to the textile product;

(ii) an improved colourfastness to perspiration when compared a textile treated by a different plasma-polymerised hexamethyldisiloxane process, but is otherwise identical to the textile product; and

(iii) improved anti-snagging properties when compared to an untreated textile a textile treated by a different plasma-polymerised hexamethyldisiloxane process, but is otherwise identical to the textile product.

BRIEF DESCRIPTION OF FIGURES

In order that the invention may be fully understood and readily put into practical effect there shall now be described by way of non-limitative example only exemplary embodiments of the present invention, the description being with reference to the accompanying illustrative drawings.

FIG. 1 is a schematic illustration of a front view of an exemplary plasma deposition apparatus. FIG. 2 is a schematic flowchart of dual energizing using the plasma deposition apparatus.

FIG. 3 is a schematic illustration of a thermal energizer of the plasma deposition apparatus.

FIG. 4(a) is a front view of an exemplary guide screen of the plasma deposition apparatus.

FIG. 4(b) is a top perspective view of the guide screen of FIG. 4(a).

FIG. 5 is a schematic cross-sectional side view of a wall of the guide screen FIG. 4(a).

FIG. 6 is a close-up cross-sectional side view of the wall of FIG. 5 showing misaligned openings between adjacent panels and change in flow direction of a chemical in plasma state. FIG. 7(a) is a front view of a first exemplary configuration of two RF electrodes in a plasma chamber of the plasma deposition apparatus.

FIG. 7(b) is a top view of the two RF electrodes in FIG. 7a(a).

FIG. 8(a) is a front view of a second exemplary configuration of two RF electrodes in a plasma chamber of the plasma deposition apparatus.

FIG. 8(b) is a top view of the two RF electrodes in FIG. 8(a).

FIG. 9 is a front view of an exemplary configuration of a plasma chamber of the plasma deposition chamber provided with a plurality of selectable vacuum ports.

FIG. 10 is a schematic illustration of an exemplary switching pattern of activation and blocking of a plurality of selectable vacuum ports.

FIG. 11 is a schematic illustration of a substrate rack configured to provide multiple items of the substrate in a plasma chamber of the plasma deposition apparatus.

FIG. 12 is a schematic illustration of a rotatable substrate rack configured to provide multiple items of the substrate in a plasma chamber of the plasma deposition apparatus.

DETAILED DESCRIPTION

Exemplary embodiments of a plasma deposition apparatus 100 for coating soft goods will be described below with reference to FIGS. 1 to 12. The same reference numerals are used throughout the figures for the same or similar parts.

In an exemplary embodiment, as shown in FIG. 1, the plasma deposition apparatus 100 comprises a plasma chamber 10 for plasma deposition of a chemical (not shown) on a substrate 200 in the plasma chamber 10. In this application, the term “chemical” is used throughout the specification to refer to one or more chemicals that are to be applied onto a substrate 200 via plasma deposition. The chemical may be provided together with one or more appropriate gases as may be required for plasma activation of the chemical. The apparatus 100 also comprises a thermal energizer 20 to thermally energize the chemical prior to plasma deposition in the plasma chamber 10, and at least one radio frequency (RF) electrode 30 provided within the plasma chamber 10 to energize by RF the thermally-energized chemical to a plasma state, i.e., an ionised gas. The apparatus 100 further comprises a guide screen 40 provided within the plasma chamber 10 between the at least one RF electrode 30 and the substrate 200 to increase turbulence of flow of the chemical in plasma state from the at least one RF electrode 30 to the substrate 200 for deposition on the substrate 200 of the chemical in plasma state with increased turbulence of flow. The plasma chamber 10 comprises a chemical inlet 12 in fluid communication with the outlet 21 of the thermal energizer 20 for flowing the thermally-energized chemical from the thermal energizer 20 into the plasma chamber 10.

The thermal energizer 20 and at least one RF electrode 30 together form a dual energizing mechanism as illustrated in FIG. 2, in which the chemical is energized by thermal energy (via the thermal energizer 20) from an atmosphere stable state to gain a molecular maximum kinetic energy, followed by release of the thermally-energized chemical into the plasma chamber 10 for excitation by RF energy (via the at least one RF electrode 30) to the plasma state. Complete energizing of the chemical within the plasma chamber 10 is required to attach the activated chemical strongly on to the substrate 200 and to apply the chemical over the entire surface of the substrate 200. With the dual energizing mechanism, almost all molecules / atoms in the plasma chamber 10 can be excited to the plasma state without requiring excessive RF energy, thereby avoiding deterioration or damage to the substrate 200 from exposure to high levels of RF energy and retaining the hand feel, colour, breathability and other properties of the substrate 200 prior to plasma treatment. Plasma deposition rate using the dual energizing mechanism is higher than conventional RF energizing plasma deposition due to availability of higher number of excited chemical molecules within the plasma chamber 10 during dwell time of the chemical in the plasma chamber 10. Consequently, time required to form a functional durable application of the chemical on the substrate 200is also reduced.

As can be seen in FIG. 3, the thermal energizer 20 comprises a heating chamber 21 having at least one fluid inlet 22, wherein one of the least one fluid inlet 22 is to supply the chemical into the heating chamber 21. An outlet 24 is provided to supply the thermally-energized chemical from the heating chamber 21 to the plasma chamber 10. A valve 25 may be provided at the outlet 24, such as a fast-switching valve actuated by a valve solenoid 26. The thermal energizer 20 also comprises a heater 23 to heat and thereby thermally energize the chemical in the heating chamber 21. The heater 23 may be configured to have a plurality of zones in a direction from the at least one fluid inlet 22 to the outlet. For example, the heater 23 may comprise three zones to facilitate even heat distribution in the heating chamber 21 with the aim of heating up every molecule in the heating chamber 21. A first (Zone 1) of the three zones may comprise a first plate (not shown) at the top of the heating chamber 21. A second (Zone 2) of the three zones may comprise a second plate (not shown) that is curved to fit around the heating chamber 21. A third (Zone 3) of the three zones may comprise a third plate (not shown) that is placed at the bottom of the heating chamber 21. In use, the heater 23 may be heated to a temperature of between 200 °C and 600 °C, for example, by heating each of the three zones to the desired temperature. Depending on the actual chemical applied, the heating temperature may be adjusted accordingly, and may also be less than 200 °C. In an exemplary embodiment, the heating chamber 21 may have a volume of at least 1.3 litres.

In an exemplary embodiment of the thermal energizer 20, two fluid inlets 22A, 22B are provided. To supply exact amounts of fluids that may be gas or liquid into the heating chamber 21, fluid injectors such as those used in the automotive industry for fuel injection into internal combustion engines are provided at the fluid inlets 22A, 22B. A fluid injector also serves as an atomizing mechanism to atomize the chemical in the heating chamber 21 to enhance heat transfer to the chemical when the chemical is supplied as a liquid into the heating chamber. For example, a liquid injector such as a Nissan FBY 1160 nozzle body liquid injector may be provided for liquid injection and a gas injector such as a Yamaha FZS 1100 fuel injector may be provided for gas injection. In the exemplary embodiment, at the first fluid inlet 22A, both a liquid injector 22L and a gas injector 22G are provided that are connected to a liquid line and a gas line for supply of a liquid and a gas respectively into the heating chamber 21. The liquid injector 22L and the gas injector 22G are driven by a first pulse width modulated (PWM) signal and a second PWM signal respectively, the first PWM signal and the second PWM signal being out of phase (for example by 180° or 170°) to ensure that both injectors 22AL, 22AG do not operate to inject fluid through the fluid inlet 22A at the same time. At the second fluid inlet 22B, only a liquid injector 22BL is provided that is also driven by a PWM signal. Fluid injectors 22AL, 22AG, 22BL at the two fluid inlets 22A, 22B can thus be driven simultaneously while being individually controlled. The number of fluid injectors connected to the heating chamber 21 may be based on maximum injector resolution and pressure of the heating chamber 21. Flow rates of the fluid injectors 22AL, 22AG, 22BL are pressure dependent. Thus, pressure at the inlets of the injectors 22AL, 22AG, 22BL is a key factor to determining the minimum and maximum flow rate of the apparatus 100, where inlet pressure is a function of the flow rate.

Alternative configurations of the thermal energizer 20 include heating the chemical with an infrared heat source, via induction heating or high frequency heating. Instead of using fluid injectors as described above, fluid metering and dosing into the thermal energizer 20 may be effected using a dosing pump, an injector or high-speed solenoid valve with continuous or pulsed dosing intervals. The plasma deposition apparatus 10 may also comprise more than one thermal energizer 20 connected in series or parallel to provide the thermally-energized chemical to the plasma chamber 10. As mentioned above, a guide screen 40 is provided within the plasma chamber 10 between the at least one RF electrode 30 and the substrate 200 to increase turbulence of flow of the chemical in plasma state from the at least one RF electrode 30 to the substrate 200. The guide screen 40 is spaced apart from walls 11 of the plasma chamber 10 so that the at least one RF electrode 30 is provided in the plasma chamber 10 in the space between the guide screen 40 and at least one wall 11 of the plasma chamber 10. This creates a region of plasma concentration in the space between the guide screen 40 and the walls 11 of the plasma chamber 10 to enhance probability of the thermally-energized chemical being energized to the plasma state. The guide screen 40 may be spaced apart from each RF electrode 30 by a displacement ranging from 30 mm to 70 mm, preferably 50 mm. The guide screen 40 as well as the plasma chamber 10 should be electrically grounded.

In an exemplary embodiment, the guide screen 30 at least partially defines a volume of at least 2600 litres in which the substrate 200 is to be provided for plasma deposition. More preferably, the volume within the guide screen 30 can accommodate about twenty to forty items of substrates to allow multiple substrate items to be treated simultaneously with the chemical via plasma deposition. In alternative embodiments, the guide screen 30 could also be configured to define a volume of less than 2600 litres depending on the size and number of items to be treated simultaneously in the plasma chamber 10.

In an exemplary configuration, the guide screen 40 may comprise three walls 41 provided in a U-shaped configuration adjacent and spaced apart from a rear wall 11 and two opposing side walls 11 of the plasma chamber 10, as shown in FIG. 1. A front of the guide screen 40 is preferably left open to allow placement of the substrate 200 within the plasma chamber 10. Preferably, the open front of the guide screen 40 is sealed when a chamber door (not shown) provided in a front wall of the plasma chamber 10 is closed to achieve a vacuum condition inside the plasma chamber 10.

The guide screen 40 is electrically conductive and comprises a number of walls 41. As can be seen in FIG. 5, each wall comprises a plurality of spaced-apart panels 42. Adjacent panels 42 in each wall 41 may be parallel and spaced apart from each other by a displacement d ranging from 10 mm to 30 mm, preferably 20 mm. Each panel 42 is provided with openings 44. The openings 44 between adjacent panels 42 are misaligned, as shown in FIG. 6, in order to change direction of flow of the chemical in plasma state through the guide screen 40, as indicated by the dashed arrows, thereby increasing turbulence of flow of the chemical in plasma state. By misaligned, it is meant that a normal central axis C of an opening 44 in one panel 42 is displaced by a distance h from the normal central axis C of all other openings 44 in an adjacent panel 42, so that an opening 44 in one panel 42 opens directly onto a solid surface of an adjacent panel 42 that would block and divert flow of the chemical in plasma state through the wall 41 of the guide screen 40. An exemplary embodiment of the guide screen 40 is shown in FIG. 4 where each panel 42 of each wall 41 comprises spaced-apart metallic strips 43, such that each opening 44 in each panel 42 comprises a slot 44 between adjacent spaced-apart metallic strips 43. Positioning of the slots 44 between adjacent panels 42 is staggered, thereby creating the misalignment of the openings 44 between adjacent panels 42. In alternative configurations (not shown), the openings in the panels of the guide screen 40 may have any other appropriate shapes such as circles, triangles, rectangles and so on, formed as through holes in the panels. While the embodiments depicted in the figures depict each wall of the guide screen as having two panels, in alternative configurations, the walls of the guide screen may each comprise more than two panels where the openings between adjacent panels are misaligned to increase flow turbulence.

The guide screen 40 may include an imperforated shield 46 to shield the substrate 200 from the thermally-energized chemical entering the plasma chamber 10 through the chemical inlet 12. In an exemplary embodiment, the imperforated shield 46 may be made of 0.2 mm gauge aluminium sheet, although thickness is not critical and the material can be any conductive material. Where the chemical inlet 12 of the plasma chamber 10 is located at the ceiling of the plasma chamber 10, the imperforated shield 46 may be provided as a roof 46 atop the upstanding walls 41 of the guide screen 40. The roof 46 may have any appropriate configuration that has a downward slope from the horizontal to facilitate flow of the thermally-energized chemical towards the walls 11 of the plasma chamber 10. For example, the roof 46 may have a half-hip, gable, pyramid hip, curved or any other appropriate configuration with a downward slope of less than 30 degrees, such as 15 degrees. In this way, the thermally-energized chemical entering the plasma chamber 10 from the ceiling chemical inlet 12 are directed in a generally laminar flow to the space where the at least one RF electrode 30 is provided, which is an area of high RF concentration, thereby increasing dwell time of the thermally-energized chemical in the plasma chamber 10 and also increasing efficiency of the RF excitation process. Increasing dwell time increases exposure of the thermally-energized chemical to RF energy, thereby increasing homogeneity of excitation of the thermally-energized chemical to the plasma state.

Preferably, at least two RF electrodes 30 are provided in the plasma chamber 10, with one RF electrode 30 adjacent at least each side wall 11 of the plasma chamber 10 as shown in FIG. 7. Each RF electrode 30 may comprise a perforated flat plate having have a length and breadth greater than 1000 mm x 1000 mm. In a variation of the configuration with two RF electrodes 30, as shown in FIG. 8, each RF electrode 30 may be an angled electrode 30 comprising perforated panels 32 provided at an angle to each other, such that for each RF electrode 30, one of the panels 32 is adjacent a side wall 11 of the plasma chamber 10 while another of the panels 32 is adjacent the rear wall 11 of the plasma chamber 10. In this way, the rear part of the plasma chamber 10 can also be used to radiate RF energy for better RF energy distribution in the plasma chamber 10 as the surface area of each RF electrode 30 is increased without comprising the voltage standing wave ratio, which is a function of impedance matching. Notably, where the RF electrode 30 is angled, the internal angle between adjacent panels should be an obtuse angle (i.e. greater than 90° and less than 180°) in order not to reduce RF energy density provided by the angled RF electrode 30. Power feed through 31 to each angled RF electrode 30 in the embodiment shown in FIG. 8 is also shorter than the power feed through 31 to each flat plate RF electrode 30 in the embodiment shown in FIG. 9. The power feed through 31 should be properly insulated to minimize RF power loss and fluctuation in reflection power. An exemplary insulation for the power feed through 31 of each RF electrode 30 is polytetrafluoroethylene (PTFE), which is a reasonable electromagnetic insulator. Another exemplary insulation material for the power feed through 31 is ceramic.

Alternatively, three or more discrete RF electrodes 30 may be provided (not shown), each electrode 30 provided adjacent a wall 11 of the plasma chamber 10. Further alternatively, a single angled RF electrode 30 may be provided that is adjacent multiple walls 11 of the plasma chamber 10 (not shown), wherein the internal angle between adjacent panels of the single RF electrode 30 is an obtuse angle. In some embodiments, RF electrodes may be provided adjacent the front wall, ceiling and/or floor of the plasma chamber (not shown). Depending on the shape and size of the plasma chamber 10, the number shape, and size of RF electrodes 30 provided in the plasma chamber 10 may accordingly vary to maximize provision of RF energy to the thermally- energized chemical in the plasma chamber 10.

By configuring the at least one RF electrode 30 to provide RF energizing of the thermally- energized chemical in the plasma chamber 10 from multiple directions, i.e., from at least the opposite sides of the plasma chamber 10 and in some configurations including also from the rear of the plasma chamber 10, the chemical in plasma state is directed and applied to the substrate 200 from different directions, uniformity of deposition of the chemical on the substrate 200 is increased compared to one-directional chemical plasma deposition. To facilitate dynamic turbulent flow or increase turbulence of flow within the plasma chamber 10 for more uniform chemical plasma deposition on the substrate 200, the plasma chamber 10 may be provided with a plurality of selectable vacuum ports 14 for outflow from the plasma chamber and to create a vacuum in the plasma chamber, as shown in FIG. 9. The vacuum ports 14 may be provided at a bottom of the plasma chamber 10, and preferably within an area defined by the guide screen 40 so as to create flow of the chemical in plasma state from the at least one RF electrode 30 through the guide screen 40 onto the substrate 200.

To allow for selectability, each vacuum port 14 is preferably provided with its own conductance control valve 14C that may be actuated by a motor 14M to control gas flow through the vacuum port 14. The conductance control valve 14C may be manually adjustable or have a fully automatic programmable interface. A valve 14V may be provided to selectably open and close connection of each vacuum port 14 to a vacuum pump 14P provided to evacuating the plasma chamber 10 through each vacuum port 14. The valve 14V may be an angle valve, and is preferably a fully closed or fully open valve that does not function as a partially closed/open valve. Using conductance control valves 14C, vacuum pressure inside the plasma chamber 10 can be controlled while keeping the vacuum pump 14P at a high vacuum state, thereby allowing the chemical in plasma state to stay a little longer inside the plasma chamber 10.

By selectably and changebly activating and blocking the plurality of vacuum ports 14, different flow paths can be continually created within the plasma chamber 10, with any appropriate frequency to optimize chemical plasma deposition on the substrate 200. FIG. 10 shows an exemplary switching pattern of activation and blocking of four selectable vacuum ports 14 in the plasma chamber 10. By creating a dynamic vacuum flow pattern in the plasma chamber 10 with changing activation and blocking of the vacuum ports 14 using the conductance control valves 14C, plasma flow distribution in the plasma chamber 10 is continually changing, thereby enhancing the turbulence nature of the flow of the chemical in plasma state in the plasma chamber 10. The conductance control valves 14C thus improve chemical distribution inside the plasma chamber 10 and reduce consumption of the chemical and other gases that may be used in the plasma deposition process. With improved chemical distribution and flow turbulence, probability of an excited chemical molecule coming into contact with the substrate 200 is increased, thereby increasing uniformity of chemical application on the substrate 200. Because of the improved uniformity of distribution of the active molecules, probability of uneven deterioration of the substrate due to excess coating formations is reduced. Increased uniformity of chemical plasma deposition due to enhanced turbulence of flow allows multiple items of the substrate to be treated at the same time, thus enhancing bulk manufacturability.

In an exemplary embodiment, each vacuum port 14 is connected to its own vacuum pump 14P. In alternative configurations (not shown), a single vacuum pump may be connected to all the vacuum ports 14. Flow profile resolution through the plasma chamber 10 may be determined using equation (1) below: flow profile resolution = f^ ^{Cmax c} ™ ^n)*i o ^(A —(1)

^ ^max ' where

Cmax = maximum allowable conductance of each conductance control valve Cmin = minimum conductance of each conductance control valve n = number of vacuum ports

To facilitate consistent and uniform chemical plasma deposition on multiple items 200 of the substrate 100, as shown in FIG. 11, the plasma deposition apparatus 10 may include a substrate rack 50 configured to allow multiple items of the substrate 200, such as t-shirts, to be provided in a spaced-apart manner from each other within the plasma chamber 10 for chemical plasma deposition at the same time. In an exemplary embodiment, the substrate rack 50 is configured to support forty t-shirts for treatment in a single run. Appreciably, the number of substrate items 200 that can be treated in a single run will be inversely proportional to the size of each substrate item. The larger the items 200, the fewer can be treated at the same time due to space constraints within the plasma chamber 10. Where the substrate rack 50 is configured to be stationary during plasma deposition, individual substrate items 200 are preferably spaced at least 5 cm apart from each other. In an alternative configuration, as shown in FIG. 12, the substrate rack 50 may be rotatable so as to continually rotate the multiple substrate items 200 about an axis of the substrate rack 50 during plasma deposition to enhance consistent and uniform plasma deposition on all substrate items 200 in the plasma chamber 10. FIG. 12 shows a rotatable substrate rack 50 having a vertical axis of rotation Y. In an alternative embodiment (not shown), a rotatable substrate rack 50 may rotate the multiple substrate items 200 about a horizontal axis of rotation. In a yet further embodiment (not shown), a rotatable substrate rack 50 may be configured to rotate the multiple substrate items 200 about both a horizontal and a vertical axis. Where the substrate rack 50 is configured to rotate during plasma deposition, individual substrate items 200 may be spaced closer to each other than during stationary plasma deposition as there is greater flow velocity and turbulence of the chemical in plasma state around each substrate item 200 to allow the chemical in plasma state to come into contact with the substrate 200. For example, during rotational plasma deposition, individual substrate items may be spaced at least 2.5 cm apart from each other for substrates with relatively low weight, for example, such as garments of low grams per square metre (gsm) fabric. The spacing between substrate items may be higher for substrates of higher gsm.

The above-described plasma deposition apparatus 10 thus enhances chemical excitation via thermal and RF energizing and enhances flow turbulence of the chemical in plasma state via changing flow direction, thereby allowing multiple items of soft goods substrates to simultaneously undergo chemical plasma treatment to obtain consistent and uniform coating or surface functionalization for bulk manufacturability.

As will be appreciated, the apparatus and method described above may be used in the batch- treatment of objects, particularly textile products, such as garments. Thus, in a further aspect of the invention, there is provided a treated textile product having at least one fabric surface, where the fabric surface is coated with plasma-polymerised hexamethyldisiloxane, wherein the textile product displays one of more of the following properties:

(a) an improved colourfastness to water when compared to an untreated textile that is otherwise identical to the textile product;

(b) an improved colourfastness to perspiration when compared to an untreated textile that is otherwise identical to the textile product; and

(c) improved anti-snagging properties when compared to an untreated textile that is otherwise identical to the textile product.

When used herein, the term “plasma-polymerised hexamethyldisiloxane” refers to hexamethyldisiloxane that has been deposited by a plasma deposition process to form a coating on the surface of a textile product. The treated textile product may be one where the textile product displays one or more of properties (a) to (c), two of more of the properties (a) to (c), or all of the properties (a) to (c) as descrbed above.

The treated textile product may be one where the plasma-polymerised hexamethyldisiloxane coating is formed using a process as described herein. In these embodiments, the treated textile product, may be one where the treated textile product displays one or more of the following properties:

(A) an improved colourfastness to water when compared to an untreated textile that is otherwise identical to the textile product;

(B) an improved colourfastness to perspiration when compared to an untreated textile that is otherwise identical to the textile product; and

(C) improved anti-snagging properties when compared to an untreated textile that is otherwise identical to the textile product.

For example, the treated textile product may be one where it displays one or more of the properties (A) to (C), two of more of the properties (A) to (C), or all of the properties (A) to (C) as described above. More particularly, the treated textile product according made using the method described above may display one or more of the following properties:

(i) an improved colourfastness to water when compared to a textile treated by a different plasma-polymerised hexamethyldisiloxane process, but is otherwise identical to the textile product;

(ii) an improved colourfastness to perspiration when compared a textile treated by a different plasma-polymerised hexamethyldisiloxane process, but is otherwise identical to the textile product; and

(iii) improved anti-snagging properties when compared to an untreated textile a textile treated by a different plasma-polymerised hexamethyldisiloxane process, but is otherwise identical to the textile product.

As will be appreciated, specific properties may be introduced into a garment made using the plasma deposition processes discussed herein. This depends on the nature of the chemicals used in the plasma deposition process. Examples of properties that may be introduced are discussed below.

1. Hydrophilic & wicking properties

Polar molecules are chemically tethered onto the yarn surface via the plasma process (i.e. they become bonded, e.g. covalently bonded to the yarn surface), which improves the surface tension or surface energy. Higher surface energy allows polar molecules (such as water) to spread throughout the fabric faster. This directly influences the wicking properties of the fabric while providing comfort through fast evaporation of sweat. 2. Anti odor/ Bacteriostatic a. Bacteriostatic nature due to hydrophobicity-Hydrophobic surfaces do not retain moisture/sweat, which is a key ingredient required to grow microbes. Due to this fact, the bacterial growth rate is reduced significantly when a garment is treated to have a hydrophobic surface. b. Bacteriostatic nature due to hydrophilicity. As mentioned in (1) above, the polarity of the fabric surface is increased when a plasma hydrophilic treatment is used. However, the cell membranes of certain microbes are repulsed by polar functional groups and this can allow one to control or inhibit the adhesion of microbes onto such surfaces. In addition, rapid evaporation of moisture/sweat from the fabric surface makes it an unsuitable habitat for microbes due to the lack of moisture I nthe fabric.

3. Colour fastness

As noted above, the plasma process introduces molecules/coatings that are covalently bonded to the yarn/fabric surface. Due to this covalent bonding, the coating will adhere well to the substrate. Also, during the plasma process, activated molecules (precursors of the coating) penetrate into the yarn at a filament level. Given this, the coating grows and propagates along the yarn and fabric surface and is anchored to the base substrate by covalent bonds. Because of this, the coating deposited by the plasma process may act as a protective layer that helps to prevent leeching of the inks/colorants/prints on the fabric surface. This may help to improve the fastness of the prints and colors in the fabric.

4. Micro fibre emission

Without wishing to be bound by theory, it is also believed that the removal of microfiber particles by mechanical processes during wear and washing is minimized in fabrics treated with the plasma treatments mentioned herein due to the protective nature of the plasma deposited coating (as described in more detail in (3) above).

5. Anti stain/ stain release

This property may be obtained when a fabric is subjected to a hydrophobic plasma treatment, particularly with a silicone starting material (e.g. HMDSO). The inert nature of silicone base surface coating provides a lower surface energy coating that reduces/prevents the adhesion of colorants onto the surface of the fanric.

6. Anti snagging/ anti piling

Without wishing to be bound by theory, it is believed that the protective nature of the coatings discussed herein (e.g. see point (3)) may also contribute to a reduction in snagging and/or piling in a fabric so treated.

7. UV resistance

Outermost plasma coating may reduce penetration of UV into/through the fabric (and some of the UV radiation may be absorbed by the coating).

8. Increased Durability

This is a cumulative effect of 3, 4, 5, 6 and 7. (color durability, surface durability, yarn durability and material degradation resistance get improved). This eventually improves the overall durability of the garment.

9. Fire resistance

Without wishing to be bound by theory, the addition of the plasma deposition coatings may make the fabric more fire resistant.

10. Oleophobicity

Without wishing to be ound by theory, it is believed that the addition of a perfluorinated plasma deposition coating to a substrate surface may help to make said surface more oleophobic.

It will be appreciated that the properties disclosed above may be enhanced when the device and/or the processes described herein are used to form the fabrics. Treatment and Testing Results

Using the above-described plasma deposition apparatus 10, different substrate materials were treated via chemical plasma deposition and tested for hydrophobicity and hydrophilicity according to American Association of Textile Chemists and Colorists (AATCC) standards, using the Water Repellency-Spray Test AATCC TM22 and Vertical Wicking of Textiles AATCC TM197 respectively. Plasma treatment of substrates may be categorized as non-polymerizable molecule treatment (NPMT) and polymerizable molecule treatment (PMT). In NPMT, no coating is formed on the substrate. However, individual activated chemical molecules are convalently bonded to the substrate during functionalization. In PMT, a coating is formed on the substrate. Table 1 below provides a list of exemplary chemicals that may be applied by plasma deposition and the substrates that they are compatible with, as well as the functionalities obtained by their application.

Table 1

Examples of treatments and corresponding test results follow below.

Example 1

In this example of PMT, monomers of hexamethyldisiloxane (HMDSO) were polymerized on different fabrics to improve hydrophobicity of the fabrics. During the plasma treatment, activation is first performed using an inert gas such as argon in the plasma chamber 10 at a gas flow rate ranging from 200 seem to 700 seem. In an exemplary embodiment, the argon gas flow rate may be 400 seem. Activation may have a duration ranging from 5 to 20 minutes, and in an exemplary embodiment, activation is for a duration of 10 minutes. Temperature of the plasma chamber 10 during both activation and polymerization may range from 150 to 200 °C, and in an exemplary embodiment, the chamber temperature is 192 °C. Percentage of energy emitted by the RF electrode 30 during both activation and polymerization may range from 50 to 90 %, and in an exemplary embodiment, the RF energy emitted during activation is 64 % while RF energy emitted during polymerization is 68 %.

During polymerization, temperature of the heater 23 of the thermal energizer 20 may range from 100 to 300 °C, and in an exemplary embodiment, temperature of the heater 23 is 200 °C. Argon gas flow rate in the thermal energizer 20 may range from 500 to 900 seem, and in an exemplary embodiment, the argon gas flow rate in the thermal energizer 20 is 700 seem. Supply rate of the HMDSO monomer into the thermal energizer 20 may range from 0.5 to 5 g/min, and in an exemplary embodiment, the HMDSO monomer supply rate is 2 g/min. Duration of polymerization may range from 15 to 45 minutes, and in an exemplary embodiment, duration of polymerization is 30 minutes. Using the exemplary embodiment of treatment parameters as described above, hydrophobicity spray test results were obtained for various fabric types provided in various forms as shown in Table 2 below:

Table 2: Hydrophobicity after silicone plasma treatment

From the results, it can be seen that fabrics treated with silicone using the above described plasma deposition apparatus 10 and treatment parameters still showed hydrophobicity after 25 wash cycles, with the exception of polyester fleece fabrics. Example 2

In this example of PMT, 2-(Perfluorohexyl) ethyl methacrylate monomers were polymerized on different fabrics to improve hydrophobicity of the fabrics. During the plasma treatment, activation is first performed using an inert gas such as argon in the plasma chamber 10 at a gas flow rate ranging from 200 seem to 700 seem. In an exemplary embodiment, the argon gas flow rate may be 400 seem. Activation may have a duration ranging from 5 to 20 minutes, and in an exemplary embodiment, activation is for a duration of 10 minutes. Temperature of the plasma chamber 10 during both activation and polymerization may range from 150 to 200 °C, and in an exemplary embodiment, the chamber temperature is 100 °C. Percentage of energy emitted by the RF electrode 30 may range from 30 to 80 % during activation and 40 to 90 % during polymerization, and in an exemplary embodiment, the RF energy emitted during activation is 50 % while RF energy emitted during polymerization is 60 %.

During polymerization, temperature of the heater 23 of the thermal energizer 20 may range from 100 to 300 °C, and in an exemplary embodiment, temperature of the heater 23 is 100 °C. Argon gas flow rate in the thermal energizer 20 may range from 500 to 900 seem, and in an exemplary embodiment, the argon gas flow rate in the thermal energizer 20 is 700 seem. Supply rate of the 2-(Perfluorohexyl) ethyl methacrylate monomers into the thermal energizer 20 may range from 0.5 to 5 g/min, and in an exemplary embodiment, the 2-(Perfluorohexyl) ethyl methacrylate monomer supply rate is 2 g/min. Duration of polymerization may range from 15 to 45 minutes, and in an exemplary embodiment, duration of polymerization is 30 minutes. Using the exemplary embodiment of treatment parameters as described above, hydrophobicity spray test results were obtained for various fabric samples of varying com7position as shown in Table 3 below:

Table 3: Hydrophobicity after 2-(Perfluorohexyl) ethyl methacrylate plasma treatment From the results, it can be seen that fabrics treated with 2-(Perfluorohexyl) ethyl methacrylate using the above described plasma deposition apparatus 10 and treatment parameters still showed hydrophobicity after 25 wash cycles, with the exception of polyester fleece fabrics.

Example 3

In this example of NPMT, fabrics were treated with water to improve hydrophilicity of the fabrics. During treatment, temperature of the plasma chamber 10 may range from 150 to 200 °C, and in an exemplary embodiment, the chamber temperature is 100 °C. Percentage of energy emitted by the RF electrode 30 may range from 50 to 90 %, and in an exemplary embodiment, the RF energy emitted is 90 %. Temperature of the heater 23 of the thermal energizer 20 may range from 50 to 200 °C, and in an exemplary embodiment, temperature of the heater 23 is 100 °C. Oxygen gas flow rate in the thermal energizer 20 may range from 10 to 70 seem, and in an exemplary embodiment, the oxygen gas flow rate in the thermal energizer 20 is 35 seem. Supply rate of the water as treatment chemical may range from 0.1 to 2 g/min, and in an exemplary embodiment, the water supply rate is 0.1 g/min. Duration of treatment may range from 10 to 50 minutes, and in an exemplary embodiment, duration of treatment is 30 minutes. Using the exemplary embodiment of treatment parameters as described above, hydrophilicity vertical wicking test results were obtained for various fabrics of varying composition as shown in Table 4 below:

Table 4: Hydrophilicity after water plasma treatment From the results, it can be seen that fabrics treated with water using the above described plasma deposition apparatus 10 and treatment parameters still showed improved hydrophilicity after 10 wash cycles.

Example 4

In this example of NPMT, fabrics were treated with argon to improve hydrophilicity of the fabrics. During treatment, temperature of the plasma chamber 10 may range from 50 to 120 °C, and in an exemplary embodiment, the chamber temperature is 100 °C. Percentage of energy emitted by the RF electrode 30 may range from 60 to 90 %, and in an exemplary embodiment, the RF energy emitted is 90 %. Temperature of the heater 23 of the thermal energizer 20 may range from 50 to 200 °C, and in an exemplary embodiment, temperature of the heater 23 is 100 °C. Oxygen gas flow rate in the thermal energizer 20 may range from 10 to 70 seem, and in an exemplary embodiment, the oxygen gas flow rate in the thermal energizer 20 is 35 seem. Argon gas flow rate as the treatment chemical may range from 300 to 600 seem, and in an exemplary embodiment, the argon gas flow rate is 480 seem. Duration of treatment may range from 10 to 50 minutes, and in an exemplary embodiment, duration of treatment is 30 minutes. Using the exemplary embodiment of treatment parameters as described above, hydrophilicity vertical wicking test results were obtained for various fabrics of varying composition as shown in Table 5 below:

Table 5: Hydrophilicity after argon plasma treatment From the results, it can be seen that fabrics treated with water using the above described plasma deposition apparatus 10 and treatment parameters still showed improved hydrophilicity after 10 wash cycles.

The above examples show that plasma treatment of fabric soft goods may be performed using the disclosed plasma deposition apparatus 10 to achieve hydrophobicity or hydrophilicity that can endure up to at least twenty-five wash cycles for many fabrics. The plasma deposition apparatus 10 allows a consistent and uniform coating or surface functionalization to be simultaneously formed on multiple soft goods substrate items treated in the apparatus 10, thereby providing for time- and cost-efficient bulk manufacture of plasma treated soft goods products.

Example 5

Selected materials in various colours were subjected to the same protocol described in Example 1 to provide treated materials. The selected materials were as follows.

85% POLYAMIDE, 15% ELASTANE, 155 GSM (for colourfastness to light, water and perspiration; Samples A and B)

77% POLYAMIDE, 23% ELASTANE, 290 GSM (for colour fastness to light, water and perspiration; Samples C and D)

AATC Multifibers No. 10 (dyed in the colours noted below, for the colourfastness to water and perspiration)

The treated materials were then tested for their colourfasteness to light (AATCC 16.3-14, Option 3, Water cooled Xenon-Arc lamp, 20 AFU), water (AATCC 107-13, Multifibers No. 10) and perspiration (AATCC 15-13, AATCC Gray Scale, Multifibers No. 10) the results are reported in Tables 6, 7 and 8, respectively.

Table 6: Colourfastnesss to Light (higher number better, Scale: 5 (no change) to 1 (significant change) After exposure, the difference in color between the exposed and protected parts of the fabric are compared to the AATCC gray scale and the degree of fading is rated. As can be seen from Table 6, the treated articles show similar to better reistance to sun bleaching when compared to an untreated sample of the same material. Procedure AATCC 107-13

This test method is designed to measure the resistance to water of dyed, printed, or otherwise colored textile yarns and fabrics. Distilled water or deionized water is used in this test method because natural (tap) water is variable in composition.

The specimen, backed by a multifiber test fabric, is immersed in water under specified conditions of temperature and time, and then placed between glass or plastic plates under specified conditions of pressure, temperature and time. The change in color of the specimen and the staining of the attached multifiber test fabric were then observed.

A and E refer to the same fabric

B ans F refer to the same fabric C And G refer to the same fabric D and H refer to the same fabric

The difference is that E, F, G and H contain the specimen sewn together with one of the multifiber fabrics.

Results are presented in Table 7. Table 7: Colourfastnesss to Water (higher number better, Scale: 5 (no change) to 1 (significant change)

Procedure AATCC 15-13 Distilled water or de-ionized water is used in this test method because natural (tap) water is variable in composition. Cut the specimen & multi-fibre at 10x4cm & sewn together. This is the composite test sample.

Each material was wetted in distilled water at room temperature and left for a periof of time to absorb water. Each material was then placed on acrylic resin plates and a weight was put onto the plates. The plates were placed in an oven at 37+ 2°C for 4hrs. The oven was then opened and allowed to dry in hot air exceeding 60°C. The change in color is assessed with the help of Grey Scale. A and E refer to the same fabric B ans F refer to the same fabric C And G refer to the same fabric D and H refer to the same fabric

The difference is that E, F, G and H are fabric specimens where one of the multifiber fabrics have been attached.

Table 8: Colourfastness to Perspiration (higher number better, Scale: 5 (no change) to 1

(significant change) Self-staining - staining from a fabric onto itself is self-staining. Self-staining is avoided by equalizing the color intensity throughout the fabric by the fabric supplier. Also, in a dyed fabric self staining cannot be clearly identified because of the color. Due to this all of the fabrics which are at a commercial grade have a 5 rating for self-staining (i.e. no colour staining). However, when garments are manufactured it is common for fabrics to be attached to other fabrics with different materials and compositions. To evaluate the staining on other materials like cotton, nylon , etc., the specimen fabric was layered with multifiber fabrics (nylon, polyester, acrylic, etc.) and subjected to wash or respiration tests. The staining on the multifiber fabrics was then evaluated.

As can be seen, the treated materials have improved colourfastness when exposed to water and perspiration than their untreated equivalents.

Grading Scale:

• 5 No colour change/ colour staining

• 4-4.5 Slight colour change/ colour staining

• 3.5 Moderate colour change/ colour staining

• 3 Noticeable colour change/ colour staining

• 2-2.5 Considerable colour change/ colour staining

• 1-1.5 Much change in colour/ colour staining

Example 6

In this example of PMT, monomers of hexamethyldisiloxane (HMDSO) were polymerized on a fabric to improve anti -snagging of the fabrics. During the plasma treatment, activation is first performed using an inert gas such as argon in the plasma chamber 10 at a gas flow rate ranging from 200 seem to 700 seem. In an exemplary embodiment, the argon gas flow rate may be 400 seem. Activation may have a duration ranging from 5 to 20 minutes, and in an exemplary embodiment, activation is for a duration of 10 minutes. Temperature of the plasma chamber 10 during both activation and polymerization may range from 150 to 200 °C, and in an exemplary embodiment, the chamber temperature is 192 °C. Percentage of energy emitted by the RF electrode 30 during both activation and polymerization may range from 50 to 90 %, and in an exemplary embodiment, the RF energy emitted during activation is 64 % while RF energy emitted during polymerization is 68 %.

During polymerization, temperature of the heater 23 of the thermal energizer 20 may range from 100 to 300 °C, and in an exemplary embodiment, temperature of the heater 23 is 200 °C. Argon gas flow rate in the thermal energizer 20 may range from 500 to 900 seem, and in an exemplary embodiment, the argon gas flow rate in the thermal energizer 20 is 700 seem. Supply rate of the HMDSO monomer into the thermal energizer 20 may range from 0.5 to 5 g/min, and in an exemplary embodiment, the HMDSO monomer supply rate is 2 g/min. Duration of polymerization may range from 15 to 45 minutes, and in an exemplary embodiment, duration of polymerization is 45 minutes. Using the exemplary embodiment of treatment parameters as described above, anti-snagging test results were obtained for the fabric provided shown in below: Fabric Details - 100% nylon, MACE Fabric, PURPLE/WHITE

SNAGGING RESISTANCE OF FABRICS: MACE (ASTM D3939-13 (R2017), ICI MACE SNAG TESTER, ICI PHOTOGRAPHIC SNAGGING STANDARD, AFTER 600 REVOLUTIONS) (SUBCONTRACTED TO AN ACCREDITED LAB)

Treated

LENGTHWISE 4.0 WIDTHWISE 4.0 Untreated LENGTHWISE 3.0

WIDTHWISE 3.0

KEY TO SNAGGING RATING GRADE 5 NO OR INSIGNIFICANT SNAGGING GRADE 4 SLIGHT SNAGGING

GRADE 3 MODERATE SNAGGING GRADE 2 SEVERE SNAGGING GRADE 1 VERY SEVERE SNAGGING As can be seen, the material obtained after treatnment is more resistant to snagging than its untreated equivalent.

Whilst there has been described in the foregoing description exemplary embodiments of the present invention, it will be understood by those skilled in the technology concerned that many variations and combination in details of design, construction and/or operation may be made without departing from the present invention. For example, while argon gas is used in the activation step during PMT, other inert gases such as helium and/or neon may alternatively be used. Example 7

Fire Resistance

Using the device described hereinbefore, a polyester/spandex blend fabric (polyester-79 %, spandex-21%, fabric gsm-240) was treated using the conditions listed in Table 10.

Table 10

The flammability test was the 45 degree flammability test (ASTM D1230-94). As can be seen, the addition of oxygen and/or nitrogen to the plasma deposition process resulted in a fabric with fire resistance (see Trial Nos. 7 and 12).

Example 8

A non-woven alcantara microfiber fabric (68% polyester and 32% polyurethane) was treated with:

2-(perfluorohexyl) ethyl methacrylate to form material C6; and 2-(perfluorooctyl) ethyl methacrylate to form material C8.

The process used was that set out in Example 2, with the only difference being the replacement of 2-(perfluorohexyl) ethyl methacrylate by 2-(perfluorooctyl) ethyl methacrylate to manufacture material C8.

The two non-woven fabric panels (C6 and C8) mentioned above were subjected to various tests of oleophobicity. Both of the non-woven fabric panels displayed no sticking or wetting of their upper surface (rating 100) when subjected to the water repellency AATCC 21-14 test. Fabric C6 showed a rating of 5.0 and Fabric C8 a rating of 7.5 when subjected to the aqueous liquid repellency AATCC 193-12 test. Fabric C6 showed a rating of 1.5 and Fabric C8 a rating of 3.0 when subjected to the oil repellency AATCC 118-13 test.