Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, MULTILAYERED PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING MULTILAYERED PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2022/030045
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition which comprises (A) one or more photopolymerizable compounds each having an ethylenically unsaturated group, (X) organic particles, and (B) a photopolymerization initiator, wherein the photopolymerizable compounds each having an ethylenically unsaturated group include (A1) a photopolymerizable compound having an acidic substituent and an alicyclic skeleton besides the ethylenically unsaturated group. Also provided are: a photosensitive resin film and a photosensitive resin film for dielectric interlayers, the photosensitive resin films being obtained from the photosensitive resin composition; a multilayered printed wiring board; a semiconductor package; and a method for producing the multilayered printed wiring board.
Inventors:
OTSUKA KOHEI (JP)
SAWAMOTO HAYATO (JP)
NAKAMURA AKIHIRO (JP)
SAKAMOTO NORIHIKO (JP)
SAWAMOTO HAYATO (JP)
NAKAMURA AKIHIRO (JP)
SAKAMOTO NORIHIKO (JP)
Application Number:
PCT/JP2021/012623
Publication Date:
February 10, 2022
Filing Date:
March 25, 2021
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD (JP)
International Classes:
C08F285/00; C08F2/44; C08F2/50; C08F290/06; G03F7/004; G03F7/027; H05K1/03; H05K3/46
Domestic Patent References:
| WO2012043282A1 | 2012-04-05 |
Foreign References:
| JP2019070720A | 2019-05-09 | |||
| JP2014091790A | 2014-05-19 | |||
| JP2015022030A | 2015-02-02 | |||
| JP2009084057A | 2009-04-23 | |||
| JP2017201369A | 2017-11-09 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
Download PDF:
Previous Patent: MEMBRANE DISTILLATION DEVICE AND METHOD FOR OPERATING SAME
Next Patent: CATHETER AND METHOD FOR ENGAGING CATHETER
Next Patent: CATHETER AND METHOD FOR ENGAGING CATHETER