Title:
PHOTOSENSITIVE COMPOSITION FOR PATTERN FORMATION, AND FLEXOGRAPHIC PLATE
Document Type and Number:
WIPO Patent Application WO/2023/026928
Kind Code:
A1
Abstract:
A photosensitive composition for pattern formation is provided which makes it possible to obtain a molded body with excellent photosensitivity, satisfactory wear resistance and excellent flexibility and ink swelling resistance. This photosensitive composition for pattern formation contains a block copolymer composition and photopolymerization initiator, wherein the block copolymer composition contains a block copolymer A1 represented by a specific formula (1) and a block copolymer A2 represented by a specific formula (2), wherein the weight average molecular weight (Mw) of the entire block copolymer composition is 300000-800000.
Inventors:
NOZAWA ATSUSHI (JP)
Application Number:
PCT/JP2022/031104
Publication Date:
March 02, 2023
Filing Date:
August 17, 2022
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
G03F7/033; B41N1/12; C08F297/04; G03F7/00; G03F7/075
Foreign References:
| JP2007279422A | 2007-10-25 | |||
| JP2006284615A | 2006-10-19 | |||
| JP2021047322A | 2021-03-25 |
Other References:
RUBBER CHEM. TECHNOL., vol. 45, 1972, pages 1295
Attorney, Agent or Firm:
TOKOSHIE PATENT FIRM (JP)
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