Title:
PHOTOSENSITIVE COMPOSITION, CURED PRODUCT, ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2024/070725
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a cured product that can suppress the presence of residues post-development and that, due to an enhanced degree of resin crosslinking and a promotion of ring-closing reactions, exhibits excellent mechanical properties even with heating at low temperatures. Another purpose of the present invention is to provide a cured product that is provided to an electronic component that exhibits an excellent migration resistance. The present invention is a photosensitive composition that satisfies the following condition (α) and contains a binder resin (A) and a photosensitizer (C) and also contains a radically polymerizable compound (B) and/or a crosslinking agent (F), wherein the binder resin (A) contains the following resin (A1) and/or resin (A2). resin (A1): a resin that contains, in the structural units in the resin main chain, at least one selected from the group consisting of the imide structure, amide structure, oxazole structure, and siloxane structure; resin (A2): a resin having a phenolic hydroxyl group in the structural units in the resin main chain; and (α) a content of at least one selected from the group consisting of sulfonic acids, phosphate esters, phosphonic acid, phosphonate esters, phosphite esters, phosphinic acid, hypophosphite esters, and carboxylic acids containing the element fluorine, wherein the total of the content of these organic acids is in a prescribed range.
Inventors:
TANIGAKI YUGO (JP)
ARAKI HITOSHI (JP)
KANEKI TAKAYUKI (JP)
ARAKI HITOSHI (JP)
KANEKI TAKAYUKI (JP)
Application Number:
PCT/JP2023/033519
Publication Date:
April 04, 2024
Filing Date:
September 14, 2023
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
G03F7/004; G03F7/023; G03F7/027; G03F7/037; G03F7/20; H01L21/312
Foreign References:
| JP2018036329A | 2018-03-08 | |||
| JP2022115907A | 2022-08-09 |
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