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Title:
PATTERN FORMATION METHOD AND ARTICLE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/140030
Kind Code:
A1
Abstract:
This pattern formation method comprises: a contacting step for bringing a curable composition arranged on a field of a substrate and containing a polymerizable compound into contact with a mold; a curing step for irradiating the curable composition arranged on the field with light to form a cured film including a pattern formed from a cured object of the curable composition; and a separation step for separating the cured film and the mold from each other. The field includes a plurality of regions. In the curing step, the curable composition is irradiated with light in accordance with a lighting intensity and a lighting time both determined according to a target line width of the pattern with respect to each of the plurality of regions.

Inventors:
KAWATA ISAO (JP)
ITO TOSHIKI (JP)
ITO YUTO (JP)
Application Number:
PCT/JP2022/047154
Publication Date:
July 27, 2023
Filing Date:
December 21, 2022
Export Citation:
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Assignee:
CANON KK (JP)
International Classes:
B29C59/02; H01L21/027
Foreign References:
JP2021034562A2021-03-01
JP2015173271A2015-10-01
JP2014175434A2014-09-22
JP2011061001A2011-03-24
JP2010103415A2010-05-06
Attorney, Agent or Firm:
OHTSUKA PATENT OFFICE, P.C. (JP)
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