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Patent Searching and Data


Title:
PARTICLE-CONTAINING RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2022/202759
Kind Code:
A1
Abstract:
Provided is a particle-containing resin composition that comprises particles having an appropriate particle size and can improve friction resistance and wear resistance characteristics even in high temperature, high load environments. The particle-containing resin composition according to the present invention comprises a resin composition and molybdenum disulfide particles. The median diameter D50 of the molybdenum disulfide particles as determined using a dynamic light-scattering technique is 10-1000 nm.

Inventors:
KOIKE AKIHIRO (JP)
KANO YUSUKE (JP)
TAKADA SHINGO (JP)
YUAN JIANJUN (JP)
Application Number:
PCT/JP2022/012998
Publication Date:
September 29, 2022
Filing Date:
March 22, 2022
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C01G39/06; C08K3/30; C08L101/00; C10M103/06; C10N10/12; C10N30/06; C10N40/04; C10N50/08
Domestic Patent References:
WO2021059325A12021-04-01
WO2021060377A12021-04-01
WO2021117666A12021-06-17
Foreign References:
JPH0680875A1994-03-22
JP2007176986A2007-07-12
JP2008286375A2008-11-27
JP2010106423A2010-05-13
JP2011068873A2011-04-07
JP2012025929A2012-02-09
JP2012159803A2012-08-23
KR20190074915A2019-06-28
JP6614471B12019-12-04
JP2009068390A2009-04-02
JP2014214341A2014-11-17
JP5777194B12015-09-09
JP2021050473A2021-04-01
Attorney, Agent or Firm:
NISHIZAWA Kazuyoshi et al. (JP)
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