Title:
PACKAGE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/210527
Kind Code:
A1
Abstract:
A package manufacturing method according to an embodiment of the present invention is a method for manufacturing a package that has a pleat extending downward from the periphery of at least a bottom surface portion thereof, and that is self-standing, the method comprising: a step for causing an elongate film 20 to travel in a longitudinal direction, and adhering an upstream-side inner surface and a downstream-side inner surface of the film 20 face-to-face to each other to thereby form a plurality of pleats 11 that extend in a widthwise direction of the film 20 at predetermined intervals; a step for controlling the orientation of the pleats 11 so that the tip-ends of the pleats 11 formed in the film 20 face the upstream side or downstream side in the travel direction of the film 20; and a step for supplying contents to the film 20 with the pleats 11 formed therein, and pillow-packaging the film 20 so that the pleats 11 are positioned at the periphery of at least the bottom surface portion of the package.
Inventors:
ASAI KENICHI (JP)
Application Number:
PCT/JP2023/015921
Publication Date:
November 02, 2023
Filing Date:
April 21, 2023
Export Citation:
Assignee:
CHOKOKU PLAST CORP (JP)
International Classes:
B65B9/20; B31B70/60; B31B155/00; B31B160/20
Domestic Patent References:
| WO2018135445A1 | 2018-07-26 |
Foreign References:
| JP2003231189A | 2003-08-19 | |||
| JP2009220872A | 2009-10-01 |
Attorney, Agent or Firm:
SAKAI, Masami et al. (JP)
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