Title:
OXIDE-CONTAINING COPPER PARTICLES, PASTE COMPOSITION, SEMICONDUCTOR DEVICE, ELECTRICAL COMPONENT AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2023/191023
Kind Code:
A1
Abstract:
The present invention provides: oxide-containing copper particles which enable the achievement of a paste composition that is capable of forming a bonding layer having high denseness, high bonding strength and high bonding reliability; a paste composition which uses the oxide-containing copper particles; and a semiconductor device, an electrical component and an electronic component. With respect to oxide-containing copper particles according to the present disclosure, the absorption spectrum as measured with a spectrophotometer by dispersing the oxide-containing copper particles in ethanol that has a mass of 1 × 106 times the mass of the oxide-containing copper particles has an absorption peak within the wavelength range of 600 nm to 1,000 nm.
Inventors:
NONOMURA KOUKI (JP)
KIKUCHI TOMONAO (JP)
KIKUCHI TOMONAO (JP)
Application Number:
PCT/JP2023/013459
Publication Date:
October 05, 2023
Filing Date:
March 31, 2023
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
B22F1/00; B22F1/054; B22F1/06; B22F1/07; B22F1/102; B22F1/103; B22F1/16; B22F7/08; B22F9/00; B22F9/20; B82Y30/00; B82Y40/00; C22C1/04; C22C32/00; H01L21/52
Domestic Patent References:
| WO2022045252A1 | 2022-03-03 |
Foreign References:
| JP2020035979A | 2020-03-05 | |||
| JP2020029392A | 2020-02-27 | |||
| KR20110008386A | 2011-01-27 | |||
| JP2020084242A | 2020-06-04 | |||
| JP2016196705A | 2016-11-24 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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