Title:
NEW PROCESS FOR COPPER POLISHING PROCESSING OF SAPPHIRE WAFER
Document Type and Number:
WIPO Patent Application WO/2018/014568
Kind Code:
A1
Abstract:
Provided is a new process for the copper polishing processing of a sapphire wafer, belonging to the field of LED substrate processing. Scratches caused in the previous procedure are removed gradually by selecting three different polishing solutions with hardnesses from high to low, fixing the injection order of the polishing solutions and controlling the injection times of the polishing solutions, so that a relatively small damaged layer is formed on the surface of a final product, thus achieving the purpose of reducing the scratches the surface of the sapphire. The process is simple to operate and has an obvious effect.
Inventors:
ZHAO NENGWEI (CN)
Application Number:
PCT/CN2017/076570
Publication Date:
January 25, 2018
Filing Date:
March 14, 2017
Export Citation:
Assignee:
EGING PHOTOVOLTAIC TECH CO LTD (CN)
International Classes:
B24B19/22; B24B39/00; B24B57/02
Foreign References:
| CN106217190A | 2016-12-14 | |||
| CN103506928A | 2014-01-15 | |||
| CN101016438A | 2007-08-15 | |||
| JP2006190890A | 2006-07-20 |
Attorney, Agent or Firm:
CHANGZHOU INNOVATION PATENT AGENCY FIRM(GENERAL PARTNER) (CN)
Download PDF: